Product Engineer – Mask Release & Design Automation

Computer Task Group, IncUNAVAILABLE, UNAVAILABLE
Remote

About The Position

Join an innovative engineering team supporting the development of next-generation semiconductor technologies. We are seeking a Product Engineer – Mask Release & Design Automation to coordinate photomask (reticle) release activities, support semiconductor tape-out operations, and develop automation solutions that streamline chip assembly and mask release workflows. This role is ideal for an engineer with semiconductor physical design experience, Python scripting expertise, and a passion for improving engineering processes through automation.

Requirements

  • 2+ years of experience in semiconductor design, mask release, tape-out, or design automation.
  • Strong Linux operating system knowledge.
  • Experience with semiconductor EDA tools such as Synopsys ICVWB, Cadence Virtuoso, or similar.
  • Proficiency with Python and Unix/Linux shell scripting.
  • Understanding of semiconductor physical layout, design rules, and fabrication processes.
  • Excellent analytical, troubleshooting, and collaboration skills.
  • Excellent verbal and written English communication skills and the ability to interact professionally with a diverse group are required.

Nice To Haves

  • Experience with lithography and photomask manufacturing processes.
  • Knowledge of mask tape-out operations, OPC, reticle frame building, and MEBES data.
  • Experience developing automation solutions for semiconductor design environments.

Responsibilities

  • Execute photomask (reticle) release activities to support semiconductor tape-out schedules.
  • Prepare and validate reticle orders for submission to external mask manufacturers.
  • Develop and maintain Python-based automation tools for chip assembly and mask release workflows.
  • Coordinate with design, process, and manufacturing teams to ensure accurate and timely reticle deliveries.
  • Review design layouts and MEBES data for quality and manufacturability.
  • Troubleshoot layout, automation, and infrastructure issues in collaboration with engineering teams.
  • Maintain accurate documentation and traceability throughout the tape-out process.

Benefits

  • competitive benefit package
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