Product Development Engineer – Thermal Engineering
About The Position
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. AMD is seeking a Thermal Engineer to serve as a key technical contributor within our advanced packaging and New Product Introduction (NPI) organization. In this role, you will drive thermal characterization, validation, and technology development activities for cutting-edge package architectures and next-generation products. You will collaborate closely with package design, reliability, manufacturing, test, and product engineering teams to evaluate thermal performance, support qualification efforts, and enable successful product ramps. This position offers the opportunity to develop innovative thermal test methodologies, influence future packaging technologies, and work with global engineering teams and manufacturing partners to solve complex thermal challenges throughout the product lifecycle.
Requirements
- The ideal candidate is a hands-on engineer who enjoys solving complex thermal challenges through a combination of experimentation, analysis, and collaboration.
- You are naturally curious, detail-oriented, and comfortable working across multiple disciplines to drive technical solutions.
- You thrive in fast-paced development environments, effectively communicate technical concepts, and demonstrate strong ownership from concept through production.
- A successful candidate will be proactive, highly analytical, and motivated to continuously improve thermal characterization techniques and engineering processes while supporting the development of industry-leading products.
- Experience in thermal engineering within semiconductor, electronics, data center, or advanced packaging environments.
- Strong understanding of heat transfer principles and thermal management techniques.
- Experience with Thermal Test Vehicles (TTVs), thermal characterization, and laboratory testing.
- Familiarity with thermal modeling, simulation correlation, and data analysis.
- Experience supporting NPI, qualification, manufacturing, and OSAT engagements.
- Strong analytical, troubleshooting, communication, and collaboration skills.
- Bachelor's degree preferred in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Materials Science & Engineering, or a related engineering discipline.
Nice To Haves
- Advanced degree in a relevant engineering field is a plus.
Responsibilities
- Serve as the thermal SME for advanced packaging technology development and NPI programs.
- Lead thermal characterization activities, including Thermal Test Vehicle (TTV) development, testing, data analysis, and validation.
- Develop thermal models and correlate simulation results with laboratory measurements.
- Partner with cross-functional teams to assess thermal performance, identify risks, and implement solutions.
- Support qualification, product bring-up, manufacturing transfers, and production activities with OSAT partners.
- Investigate thermal issues, perform root-cause analysis, and drive corrective actions.
- Contribute to future technology pathfinding and continuous improvement of thermal methodologies and infrastructure.
Benefits
- AMD benefits at a glance.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
