Experienced Process Integration Engineering (PIE) Engineer

Samsung Electronics•Taylor, TX

1d•$95,000 - $120,000•Onsite

About The Position

The Manufacture Integration Engineering (PIE) team is focused on 2nm advanced technology transfer, process setup, qualification, and manufacturing ramp at our Taylor semiconductor facility. This position is ideal for an engineer with semiconductor process, integration, device, yield, or manufacturing experience who is interested in developing expertise in advanced GAA technology.

Requirements

Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related technical field.
Experience in semiconductor manufacturing, process engineering, process integration, device engineering, yield engineering, or related fields.
Experience with CMOS, FinFET, GAA, or other semiconductor technologies.
Basic understanding of semiconductor manufacturing processes or semiconductor device fundamentals.
Strong analytical and problem-solving skills.
Ability to analyze engineering data and communicate technical findings.
Ability to work effectively in a cross-functional engineering environment.
Strong ownership, communication, and teamwork skills.
Project management skills
Analysis skills, including yield analysis, electrical device characterization, yield issue investigations, data mining, DOE, and SPC
Expertise in Excel, PowerPoint, and various statistics programs (i.e. JMP, Spotfire)
Must be capable of shifting focus and changing priorities - dealing with ambiguity.
Must demonstrate strong core values including: Integrity, Respect, Teamwork, Quality, and Continuous Learning.
Must have excellent communication, documentation and presentation skills.
Must have interpersonal skills to escalate issues, get support, and effect lasting change.
Must have proven skills of peer leadership, and mentoring of junior level engineers.
Demonstrated ability to meet deadlines and commitments.
Must be able to work on different shifts based on project need.

Nice To Haves

Programming and/or scripting experience is a plus

Responsibilities

Lead 2nm technology transfer, NPI, process setup, qualification, and manufacturing readiness.
Monitor and analyze inline, electrical, process, and yield data to identify process or integration issues.
Support engineering lot execution, wafer disposition, process changes, and technical issue resolution.
Perform root-cause analysis and support corrective actions for process excursions and yield issues.
Support DOE and process-window studies to improve process stability, yield, and performance.
Evaluate interactions between process modules and their impact on device and product performance.
Work with Process Architecture, Module, Device, Yield, Manufacturing, and Quality teams to resolve cross-functional technical issues.
Support NPI activities and advanced-node manufacturing ramp.
Develop and maintain technical documentation, process specifications, and engineering best-known methods.
Drive continuous improvement in process stability, yield, quality, and manufacturing execution.