Process Integration Engineer

Samsung Electronics•Taylor, TX

1d•Onsite

About The Position

The New Technology Bridge (NTB) team focuses on new technology development, device targeting, and yield and defect improvement. This talented group of team members also handle design weak point optimization via mask DOE, process manufacturability, and new technology qualification. In your role as the Process Integration Engineer, you'll be responsible for understanding of 8,10,14,28nm process flows, including process integration, yield enhancement, electrical test (ET), reliability, BKMs, and DOEs. You'll work to design, analyze layout weak points, and verify results using physical measurements (TEM, SEM).

Requirements

Bachelor’s degree in Physics, Chemistry, Electrical Engineering, Chemical Engineering, Materials Science or related field with 2+ years of experience in semiconductor industry
In-depth understanding of Replacement Metal Gate (RMG) module integration is preferred.
Basic understanding of unit processes including thin films deposition, lithography, etch, diffusion, wet process, Cu plating, and CMP.
Applicants must be authorized to access such information or eligible for government authorization.

Nice To Haves

Master's or PhD is preferred

Responsibilities

Managing projects related to new technology development and qualification, yield improvement, and other quality KPI improvements.
Designing, executing, and analyzing experiments.
Utilizing software to analyze data including statistical analysis; Consulting with leadership team on experimental results in order to make decisions about large-scale changes.
Trouble shooting issues affecting Yield, defect, electrical performance of products.
Developing Change Point Management plans.
Communicating technical information with presentation.