New College Grad - Process Integration Engineer

Micron Technology • Boise, ID

1d

About The Position

Micron’s Process Integration (PI) team is at the forefront of technology development and manufacturing excellence. The team focuses on optimizing semiconductor processes to improve yield, reduce costs, and enable next-generation memory devices. By collaborating closely with Technology Development, Product Engineering, Manufacturing, and Quality teams, Process Integration ensures seamless technology transfer while driving continuous improvement in product performance, quality, and reliability.
As a Process Integration Engineer, you will contribute to the development, optimization, and transfer of advanced semiconductor manufacturing processes for next-generation memory technologies. In this role, you will analyze process performance, drive yield improvements, and support qualifications of new technologies, materials, and equipment. You will work in a collaborative, fast-paced environment partnering with multi-functional teams to deliver industry-leading quality, reliability, and manufacturing excellence.

Requirements

• Bachelor’s degree in Materials Science, Electrical Engineering, Electronics Engineering, Chemical Engineering, or a related engineering subject area.
• Basic understanding of MOSFET, CMOS, and DRAM device operation and characterization methods.
• Knowledge of statistical process control (SPC), Design of Experiments (DOE), and data analysis tools such as JMP.
• Understanding of semiconductor manufacturing processes and problem-solving methodologies.
• Ability to analyze data and support manufacturing control systems, including SPC/FDC/RMS/APC environments.

Nice To Haves

• Master’s degree or PhD in Materials Science, Electrical Engineering, Chemical Engineering, or a related technical field.
• Internship, co-op, or research experience within a semiconductor manufacturing environment, preferably 300mm wafer fabrication.
• Exposure to semiconductor and memory technologies, transistor integration, metallization processes, yield ramp, and fabrication operations.
• Experience employing AI tools, automation solutions, or data analytics to improve engineering workflows and decision-making.
• Experience and/or interest in developing Agentic AI workflows into current or future processes.

Responsibilities

• Own semiconductor process modules and lead root cause investigations and failure analysis in time-sensitive manufacturing environments!
• Drive improvements in yield, cost efficiency, quality, and overall process performance.
• Design, implement, and analyze experiments (DOE) to improve process capability and operating margins.
• Monitor process trends, sustain line stability, and address top yield and reliability detractors.
• Support technology transfer activities, including leading technical workshops and knowledge-sharing initiatives for next-generation products.
• Develop, optimize, validate, and qualify new processes, equipment, and materials to support product introductions.
• Utilize methodologies such as FMEA, 8D, SPC, and FDC to identify and resolve process-related issues.
• Support supplier quality activities, internal and external audits, and be willing to travel internationally for extended training or technology transfer assignments as business needs require.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level