Process Integration Engineer, NPI

PHOTRONICS INCBoise, ID
Onsite

About The Position

Photronics is seeking a Process Integration (NPI) Engineer responsible for the successful introduction of new photomask products, technologies, and customer designs from development through high-volume manufacturing. This role owns end-to-end mask process integration, ensuring seamless interaction between data prep, writing, etch, inspection, repair, and final quality while meeting CD, overlay, defectivity, cycle time, and cost targets. The ideal candidate combines strong technical depth in photomask processes, disciplined change control, and the ability to operate in a high-mix, low-volume, precision manufacturing environment where first-pass success is critical.

Requirements

  • Hands-on experience with lithography process development and troubleshooting in a cleanroom or manufacturing environment.
  • Strong understanding of photolithography and patterning processes.
  • Ability to interpret large datasets and drive actionable insights.
  • 5–7 years of hands-on experience in semiconductor manufacturing, photolithography, photomask engineering.
  • 3+ years of experience in semiconductor, photomask, or advanced microfabrication manufacturing, with direct experience in photolithography or patterning processes.
  • Experience with inspection, defect analysis, or yield engineering.
  • Experience with SPC, data analysis, and root cause methodologies.
  • Familiarity with Cleanroom operations.

Nice To Haves

  • Experience qualifying new tools, materials, or recipes in R&D and/or high-volume manufacturing, a plus.
  • Experience with scripting, automation, or data analysis tools, a plus.

Responsibilities

  • Lead end-to-end process integration for new photomask products across logic, memory, analog, and test applications.
  • Serve as the primary technical owner from customer tape-in through qualification and production ramp.
  • Optimize process flows, window specifications, and control strategies.
  • Drive first-time-right execution for new nodes, layers, and mask architectures.
  • Interface across all mask fabrication modules including MDP/OPC/fracture, writing, resist processing, etch, metrology, inspection, repair, and final QA/shipment.
  • Identify and resolve cross-module handoff gaps that impact yield, quality, or cycle time.
  • Lead root cause analysis for NPI yield loss, CD errors, registration issues, and defect excursions.

Benefits

  • Competitive salary and annual bonus program.
  • Equity compensation eligibility.
  • Full suite of health and welfare benefits.
  • 401k with company match.
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