Process Integration Engineer E3 Senior

Applied Materials•Albany, NY

1d•$108,000 - $148,500•Onsite

About The Position

Within the Office of the CTO, we are pioneering next-generation technologies that will drive energy-efficient computing and communications. Our team is developing innovative slow-and-wide photonic interconnect architectures to address the growing data movement bottleneck in AI data centers, leveraging Applied Materials’ leadership in photonics, heterogeneous integration, and advanced packaging technologies. To accelerate this vision, we are seeking a passionate and innovative technologist with a strong semiconductor background to develop device architectures, process technologies, and integration solutions for emerging photonic platforms and future technology inflections. This role offers a unique opportunity to work at the forefront of semiconductor and photonics innovation, helping define the next generation of computing and communication systems.

Requirements

Ph.D. in Electrical Engineering, Materials Science, Physics, or related discipline (Master’s degree with relevant industry experience will be considered)
Strong experience in semiconductor process integration in leading fab / foundry
Knowledges of semiconductor unit processes including lithography, etch, thin film deposition, metallization, implant, CMP, etc.
Strong experience in yield analysis, metrology, and SPC implementation
Proven ability to work effectively in matrixed, cross-functional teams

Nice To Haves

Experience in heterogeneous integration of GaN and III/V material with Si platform
Experience in photonic devices, co-packaged optics (CPO), or optical interconnect technologies
Demonstrated depth in building, debugging, and optimizing device integration flows.
Strong innovation mindset with the ability to develop novel, out-of-the-box integration solutions to complex technical challenges.
Proven ability to influence and align stakeholders without direct authority across diverse functional teams.
Clear and structured communication of complex integration challenges, trade-offs, and solutions to both technical and non-technical audiences.
Strong discipline in process documentation, change management, and data-driven decision-making

Responsibilities

Lead process integration for advanced semiconductor and photonic devices, enabling next-generation high-performance interconnect technologies
Translate device architectures and design layouts into robust, manufacturable process flows across development and pilot manufacturing
Drive C&F activities, including rapid proof-of-concept and prototyping builds
Define and track critical process parameters and integration metrics; partner with module owners to optimize unit processes
Drive yield improvement, SPC, and CIP across complex fabrication flows
Conduct optical, electrical, and tolerance analyses to improve device efficiency, scalability, and manufacturability
Collaborate cross-functionally with process engineering, product development, design, and production teams to accelerate technology development
Engage with external vendors, partners and customers to support technology development, material selection, and process scaling