Applied Materials' Integrated Materials Solution Group is searching for an intern to join our team in fall 2026 for 6+ months. Our group explores and builds novel devices in the ICAPS (Internet of Things, Communications, Automotive, Power and Sensors) and Advanced wafer level heterogeneous integration technology sectors. Our opportunity will give you hands-on experience in semiconductor and advanced packaging process environments, and help you establish an understanding of the relationships between device design, material physics, process development, technology integration and functional characterization.
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Job Type
Full-time
Career Level
Intern
Number of Employees
11-50 employees