Process Integration Development Manager

Intel Corporation•Chandler, AZ

1d•Hybrid

About The Position

Manufacturing Development and Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High Volume Manufacturing (HVM), advancing technology nodes from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. MDCE is also chartered to develop new technologies on mature node infrastructure to bring new solutions to new customers at reliable yield and performance and low cost, and this is where you are going to play a role. As a Process Integration Development Engineering Manager, you will lead and inspire a high-performing team of process integration and yield development engineers within Intel's Fab Sort Manufacturing (FSM) organization. You will play a pivotal role in defining and qualifying innovative integrated process solutions to meet quality, yield, and output targets for Intel advanced and mature node new semiconductor technologies. Your work will directly influence Intel's ability to scale new processes into high-volume manufacturing, drive yield improvement, and meet the technical demands of internal and external customers. By fostering collaboration across global teams and leveraging data-driven methodologies, you will not only enhance yield ramp-up efficiency but also position Intel as a leader in advanced semiconductor manufacturing.

Requirements

Bachelor's degree in Electrical Engineering, Physics, Materials Science, or a related engineering/science discipline.
9+ years of experience in advanced semiconductor process integration, with demonstrated expertise in yield improvement methodologies and defect detection.
6+ years of experience with a Master's degree, or 4+ years with a PhD.
Proven track record in using statistical tools and data-driven decisions to drive process improvements.
Proficiency in semiconductor process technologies such as lithography, etch, CMP, thin films, and metrology.
Experience in managing, coaching, and developing engineering teams to achieve technical and strategic objectives.

Nice To Haves

PhD in Electrical Engineering, Physics, Materials Science, or a related field.
Deep understanding of semiconductor device physics, failure modes, and high-volume manufacturing processes.
Experience in working with external customers, particularly in a semiconductor foundry environment.

Responsibilities

Manage and coach a team of engineers to execute yield roadmaps, optimize integration strategies, and deliver on performance targets.
Collaborate with global technology development teams to transition new technologies to production fabs.
Develop and deploy tools, methodologies, and algorithms for inline and offline yield and defect analysis.
Execute root cause analysis for yield and performance issues, proposing actionable mitigation plans within defined timelines.
Innovate inline monitoring and detection techniques to identify potential end-of-line failures during inline processing.
Define yield targets aligned with technology maturity milestones, ensuring baseline defect root cause understanding through low-yield analytics.
Drive process simplifications and cost-reduction opportunities while maintaining quality and operational excellence.
Partner with internal and external customers to meet their product specifications and technology requirements.
Develop long-term strategies for process integration and yield engineering to support the organization's future growth and technology needs.
Foster an inclusive and engaging work environment while role modeling Intel's values and expectations.