Process Integration and Yield Technician

Intel Corporation•Chandler, AZ

2d•$51,710 - $99,770•Onsite

About The Position

We are part of the assembly and test technology development team based in Chandler, supporting advanced electronic packaging technology development. Our team directly supports quality and reliability failure analysis and also supports package material and assembly process development. The candidate will be responsible for conducting failure analysis to identify electrical failures, as well as physical failure analysis to support root cause understanding of new package technologies. Require setting up, operating and maintaining laboratory instruments, conducting experiments, making observations and documenting results, and often developing conclusions. The work schedule will be 10x4 (10hr per day, Sunday – Wednesday or Wednesday – Saturday).

Requirements

Associate degree or Bachelor's degree in Material Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering or related fields of study.
Familiar with basic scientific principles.
Some laboratory experience.
1+ years of hands-on project experience on a scientific topic.
Verbal and technical writing skills.
Ability to work well with a team, deliver under pressure, and be well organized.

Nice To Haves

Prior experience with electrical failure analysis.
Prior experience with mechanical polisher.
Prior experience with optical microscope.
Prior experience with electron microscopy.
Some understanding of packaging material property and behavior.

Responsibilities

Conducting failure analysis to identify electrical failures.
Conducting physical failure analysis to support root cause understanding of new package technologies.
Setting up, operating and maintaining laboratory instruments.
Conducting experiments, making observations and documenting results.
Developing conclusions based on experimental results.