Process Engineer 5

Lam ResearchFremont, CA
Hybrid

About The Position

In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry. As a Process Engineer at Lam, you’ll work at the leading edge of semiconductor innovation—applying atomic precision, material science, and surface engineering to solve problems that define what’s next. You’ll own critical process development from concept to customer-ready performance: creating advanced process formulations, shaping equipment hardware requirements, and turning complex test data into clear technical decisions. Your work will directly influence customer outcomes and help enable the next wave of semiconductor breakthroughs. You’ll be a core contributor within the Etch Product Group, collaborating with experts across engineering, product, and customer teams to deliver measurable gains in capability, yield, and adoption.

Requirements

  • Master’s degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field with 8+ years of experience; or a PhD with 5+ years’ experience; or equivalent experience.

Nice To Haves

  • Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques.
  • In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
  • Highly proficient in MATLAB, Python, or other similar scientific computing language.
  • Working knowledge of statistical analysis and problem-solving methodologies.
  • Experience with statistical tools (JMP, Minitab, etc.)
  • Background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD).
  • Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP).
  • Knowledge of Material synthesis and material characterization.
  • Experience working in a collaborative and matrixed environment with diverse teams, semiconductor customers, and/or partners.
  • Experience in semiconductor, process design, deposition, etch dielectrics or conductor, metal films, etc.

Responsibilities

  • Lead process engineering research, development, and evaluation for Lam’s next-generation semiconductor equipment and systems.
  • Elevate manufacturing and fabrication performance by refining processing techniques, methods, and control strategies.
  • Design and sustain new processes and step-change improvements that reduce cost, increase yield, and improve tool capability.
  • Analyze test data to drive fast, evidence-based iteration—setting process windows, key variables, and specification limits.
  • Partner with internal teams to plan demos, execute experiments, interpret results, and deliver crisp technical readouts for customers.
  • Work cross-functionally—and directly with customers—to understand roadmaps, inflection points, requirements, and the business problems your work will solve.
  • Influence next-generation product development and release by translating process learning into hardware, software, and system-level requirements.
  • Provide technical leadership and day-to-day direction to process technicians to ensure safe, disciplined, high-throughput execution.
  • Drive technology transfer and adoption at customer sites—turning new capabilities into real-world impact.

Benefits

  • Comprehensive set of outstanding benefits
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