Sr. Process Engineer (Starlink)

SpaceXBastrop, TX
Onsite

About The Position

Keeping our production tools running and our processes stable is what turns engineering designs into product at volume. We are seeking a Sr. Process Engineer to own the day-to-day operation, uptime, and optimization of the packaging and assembly tools on our production floor.

Requirements

  • BS or MS in an engineering discipline
  • 5+ years of experience in semiconductor packaging, assembly, process engineering or advanced manufacturing

Nice To Haves

  • Direct experience qualifying or operating production equipment in a high-volume production environment
  • Knowledge of sub-µm die-bonding, wafer prep, and materials used in advanced packaging
  • Familiarity with statistical process control and root cause analysis methods
  • 2+ years of experience in process development or yield improvement for optical, photonic, or microelectronic devices
  • Strong troubleshooting skills with experience maintaining high-uptime operation of precision manufacturing tools
  • Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding
  • Ability to interpret process documentation, equipment specifications, and production data to drive consistent output
  • Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams

Responsibilities

  • Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders
  • Design production processes from the lab bench through proof of concept and production ramp
  • Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specs
  • Troubleshoot tool and process issues in real-time, minimizing downtime, and driving fast root-cause resolution
  • Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging
  • Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction
  • Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles
  • Support factory scaling efforts, qualifying new tools and recipes that enhance unit throughput and yield
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