Process Engineer, Principal

MACOM Technology Solutions Holdings, Inc.•Lowell, MA

7d•$117,000 - $171,000•Onsite

About The Position

MACOM is a global leader in advanced semiconductor products, seeking a Principal Process Engineer to support backend wafer fabrication processes. This role involves hands-on support for grinding, polishing, glassing, wafer bonding, and mounting/dismounting operations within MACOM's internal wafer fabrication facility. The position also requires supporting additional manufacturing areas, serving as backup coverage, and developing new manufacturing processes while sustaining and continuously improving existing ones. The product portfolio includes technologies based on GaN, GaAs, Si, and InP materials.

Requirements

BS in Engineering.
Minimum 8 years of relevant work experience in semiconductors / Wafer fabrication process.
Familiarity with typical material systems used in compound semiconductors.
Solid understanding of device physics and IC processing.
Demonstrated knowledge of compound semiconductor processing in a wafer fabrication environment or similar setting.
Excellent judgment, familiarity with semiconductor processing, and an optimistic, proactive approach.
Ability to develop solutions using formal education, statistical methods, and structured problem-solving tools.
Proven track record of solving technical problems, owning projects, meeting deadlines, and managing multiple tasks.
Strong sense of ownership, enthusiasm, and dedication to process improvement.
Ability to work collaboratively with cross-functional teams to enhance processes.
Excellent verbal and written communication skills, including technical writing for data summaries, findings, process specifications, equipment documentation, and work instructions.
Knowledge of optical component fabrication and polishing.
Knowledge of wafer polishing, Wafer Grinding, Edge Grinding, and CMP processes.
Hands-on experience in wafer fabrication processes.
Basic project management experience and ability to work with minimal supervision.
Strong presentation skills and ability to communicate effectively with all levels of management and across diverse departments.
U.S. Citizen or Permanent Resident due to ITAR restrictions.

Nice To Haves

Experience with data mining, statistics, SPC, DOE, Lean manufacturing, Six Sigma, and structured problem-solving methodologies is preferred.

Responsibilities

Develop, continuously improve, and sustain processes in close partnership with Device and Integration Engineering and Business Unit design teams.
Serve in a hands-on capacity requiring a broad understanding of wafer fabrication equipment and processes, including setup, qualification, optimization, and troubleshooting of automated equipment for Wafer Grinding, Edge Grinding, Chemical-Mechanical Planarization (CMP), Polishing, Wafer Bonding, Mount/Demount processes, and glassing.
Sustain wafer fabrication processes to meet all factory indicators; plan and execute experiments to fully characterize processes throughout the development cycle; drive improvements in quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics.
Provide daily process support, including equipment setup, writing new programs, adjusting/optimizing parameters, running engineering lots, troubleshooting equipment, and supporting production in identifying, responding to, and dispositioning non-conforming material.
Take ownership of entire processes, including equipment selection, process and equipment qualification, writing detailed setup instructions and procedures, and training operators, technicians, and other engineers on equipment operation.
Update and create routing documentation as needed.
Apply general knowledge of electronics manufacturing and maintain strong technical understanding of wafer fabrication processes.