Process Engineer Intern, MS - Summer 2027
About The Position
In this role, you will support Marvell's AI Products team and gain hands-on exposure to the assembly and packaging technologies — including 2.5D/3D chip-on-wafer development and co-packaged optics — that bring AI silicon from concept to high-volume manufacturing. These technologies are foundational to how Marvell's AI silicon achieves the performance, density, and bandwidth needed for next-generation data center infrastructure. Responsibilities include supporting data tracking for foundry and OSAT partner activities, helping document risks and mitigation plans during the New Product Introduction (NPI) phase, and contributing to reports summarizing technical progress. This role suits someone curious about semiconductor manufacturing and advanced packaging, with strong communication skills and a proactive attitude toward fast-paced, hands-on learning.
Requirements
- Currently enrolled in a Master's Degree in Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Physics, or a related field with an expected graduation date of Fall 2027 – Summer 2028
- Coursework or academic project experience related to semiconductor processing, materials science, or packaging/assembly technologies
- Familiarity with data analysis and organization using tools such as Excel, JMP, or Minitab
- Strong written and verbal communication skills, with the ability to summarize technical information clearly for cross-functional audiences
- Demonstrated ability to work independently and manage multiple tasks in a fast-paced environment
Nice To Haves
- Exposure to advanced packaging concepts such as 2.5D/3D chip-on-wafer assembly or co-packaged optics through coursework, research, or internship experience
- Familiarity with programming or scripting languages such as Python for data analysis
- Prior internship or research experience in a semiconductor, manufacturing, or process engineering setting
- Basic understanding of reliability testing or failure analysis concepts
Responsibilities
- Support process development activities for 2.5D/3D chip-on-wafer assembly and co-packaged optics in collaboration with foundry and OSAT partners
- Track and analyze data related to packaging builds to help identify trends and potential risks during NPI phase
- Document risks and mitigation plans as products mature toward high-volume manufacturing readiness
- Participate in partner and internal team meetings to gain exposure to design-for-manufacturing, process development, reliability and cost-tradeoff discussions
Benefits
- medical, dental, and vision coverage
- perks and discounts
- robust mental health resources to prioritize emotional well-being
- paid holidays
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What This Job Offers
Career Level
Intern
