Process Engineer E4

Applied Materials • Santa Clara, CA

7d • $147,000 - $202,500 • Onsite

About The Position

As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects. The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging.

Requirements

• Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
• 5 years of experience in advanced packaging specializing in logic, DRAM or NAND
• Strong communication skills to be effective in dealing with business units, cross-functional teams, internal or external customers
• Lead projects across organization and culture in a fast-paced environment
• Self-starter, team player and able to work independently with minimal supervision

Nice To Haves

• Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV, thermal management, optics and multi-wafer stacking with deep understanding of materials, process, device physics and integration.
• Ability to drive new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology.
• Proven track record of solving complex problems through innovation and ideation of novel approaches.
• Ability to define and develop differentiated modules by leveraging Applied’s broad portfolio of tools.
• Thought leader to define and maintain Applied’s roadmap in hybrid and fusion bonding for emerging device architectures
• Experience with MES systems for Si fab processing is a plus.

Responsibilities

• Designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies.
• Collecting and analyzing data.
• Performing hardware characterization.
• Troubleshooting engineering issues.
• Measuring film properties.
• Generating technical documentation.
• Engaging with customers to resolve concerns.
• Collaborating with vendors and suppliers.
• Implementing new technologies and products.
• Experimenting, learning, and collaborating with R&D teams on research and development projects.
• Developing new modules in Advanced Semiconductor Packaging.

Benefits

• Supportive work culture that encourages learning, development, and career growth.
• Programs and support that encourage personal and professional growth.
• Comprehensive benefits package.
• Eligibility for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Associate degree