Process Engineer - Bonding

BAE Systems•Nashua, NH

22h•Onsite

About The Position

This role is for a Process Engineer within the Electronic Combat Solutions (ECS) division, specifically supporting the "wire and ribbon bonding" cell in a microelectronics manufacturing environment. The position involves coordinating with various functions to address front-line issues and drive continuous improvement for cost reduction. The engineer will work with automated and manual wedge bonding and ball bonding equipment, bond pull and ball shear equipment, plasma cleaners, and automated optical inspection equipment. The role also includes engaging with tool and fixture design engineers and/or CAD software, interacting with operators to understand and resolve day-to-day problems, and communicating with suppliers to address material issues. This process engineering job will effectively lead a group of 3-5 cross-functional employees and will be empowered to help with various decisions that improve the overall success of the microelectronics factory (yield improvements, cost take out, delivery improvements).

Requirements

B.S. in Engineering (all types considered, Mechanical, Electrical, Chemical, Industrial preferred) and 2 years of experience, or 6 years of experience in lieu of a degree
Manufacturing experience with equipment support
Effective communication (cross shift, written/Power Point, can various levels of audiences)

Nice To Haves

Secret clearance, or ability to obtain is preferred, not required
Lean manufacturing knowledge
Six Sigma training or projects preferred
Familiarity with Windows based applications
Experience with Palomar 8000 series and 9000 series autobonding equipment, Nordson Dage bond pull equipment, Westbond manual bonding equipment preferred
Experience with automated manufacturing equipment (programming, maintaining, troubleshooting)

Responsibilities

Coordinate with various functions to support front line issues.
Drive continuous improvement activity for cost reduction in the factory.
Support the wire and ribbon bonding cell.
Utilize automated and manual wedge bonding and ball bonding equipment, bond pull and ball shear equipment, plasma cleaners, and automated optical inspection equipment.
Engage with tool and fixture design engineers and/or CAD software to improve assembly aides.
Interact with operators to understand day-to-day problems and plan resolutions.
Interact with suppliers and communicate material problems effectively.
Lead a group of 3-5 cross-functional employees.
Make decisions to improve the overall success of the microelectronics factory (yield improvements, cost take out, delivery improvements).