Process Development Engineer

QorvoRichardson, TX
Onsite

About The Position

Qorvo supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Requirements

  • BS in Physics, Chemistry, Engineering, Materials, or other physical sciences.
  • 2+ years of semiconductor processing experience.
  • Demonstrated success in solving multidisciplinary problems.
  • A grasp of semiconductor device fundamentals, including solid-state physics concepts, transistor characterization, the integration of multi-layer interconnects, and basic packaging techniques is required.
  • Ability to use the scientific method in solving problems, including the design of experiments, statistical analysis of results, and reporting of findings.
  • Must be able to work within a fast-paced team environment where problem solving occurs with the cooperation and support of multiple engineers.
  • Excellent written, oral, and interpersonal communications skills are fundamental.
  • Attention to detail and the ability to self-manage the completion of tasks with little supervision.

Nice To Haves

  • Expertise in the areas of back-end processes including wafer bonding and de-bonding, wafer thinning, singulation, and pick-and-place will be helpful.
  • Hands-on experience with fragile thinned wafers, dicing frames, cleaning of wafers with solvents and aqueous solutions, and the use of adhesives and ancillary materials for temporary bonding would be beneficial.

Responsibilities

  • Develop, optimize, and sustain processes used for semiconductor fabrication supporting GaAs, GaN, and acoustic wave technology.
  • Transfer newly developed processes into high volume manufacturing requiring defect reduction, yield ramp activities, SPC, and cycle time reduction.
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