This job opportunity is for an Assembly (Packaging) Process Engineer with a thorough and detailed understanding of and experience with a wide range of electronic packaging processes in a manufacturing environment. The ideal candidate would be familiar with one or more of the following: wire bonding, solder attach, polymer dispensing, transfer molding, trim and form, writing work instructions and PFMEA, statistical process control charts, automotive supplier manufacturing, etc. Strong consideration will be given to candidates with volume automated manufacturing expertise in at least one of the process areas listed. Wolfspeed is a powerhouse semiconductor company focused on silicon carbide and GaN technologies. After more than thirty years of forging new technology adoption and transformation, our Wolfspeed® power and radio frequency (RF) semiconductors are leading the industry through unrivaled expertise and capacity.
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Job Type
Full-time
Career Level
Senior
Education Level
No Education Listed