Probe Process Engineer

Western Digital•Fremont, CA

11d•Onsite

About The Position

The Process Engineer will support wafer probe operations for both product development and high-volume manufacturing environments. This role is responsible for developing, sustaining, and optimizing wafer probe processes, test methodologies, SPC systems, probe card configurations, and test setup infrastructure. The engineer will work closely with Test Engineering, Product Development, Yield Engineering, Manufacturing, and Operations teams to ensure robust process control, measurement integrity, and successful new product introductions.

Requirements

BS/MS in Electrical Engineering, Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or related discipline.
Experience in semiconductor manufacturing, wafer probe engineering, or test engineering.
Demonstrated proficiency in electrical measurement techniques with hands-on experience in laboratory and cleanroom environments.
Strong understanding of statistical process control (SPC), design of experiments (DOE), and semiconductor test methodologies.
Proficiency with data analysis tools such as SQL, Python, JMP, Minitab, or equivalent platforms.
Demonstrated knowledge of measurement system analysis (MSA), gauge R&R, and process capability studies.
Proven experience with yield optimization, maintenance protocols, and failure analysis.
Track record of driving process improvements through automation, machine learning, or AI-based initiatives.
Exceptional troubleshooting and root-cause analysis capabilities.
Strong communication and cross-functional collaboration skills with manufacturing, design, and quality teams.

Responsibilities

Develop, qualify, and sustain wafer probe processes for new and existing products, including probe recipes, operating specifications, setup requirements, and engineering controls across both product development and high-volume manufacturing environments.
Define, validate, and maintain probe card configurations and wafer test setups, supporting qualifications, releases, maintenance strategies, and change management to ensure test readiness for engineering builds, qualifications, and production ramps.
Monitor and optimize process performance using SPC, EDC, and statistical analysis; develop and maintain control limits, OCAPs, screening methodologies, and engineering dashboards to ensure measurement integrity and data accuracy.
Investigate process excursions and implement data-driven corrective actions through characterization studies, gauge capability evaluations, and tool correlation analyses to improve yield, quality, and cycle time.
Lead wafer probe readiness for New Product Introductions (NPI), defining product-specific test plans, specifications, and qualification strategies while coordinating cross-functional activities to ensure seamless transfer from development to high-volume manufacturing.
Drive continuous improvement initiatives targeting yield enhancement, cycle time reduction, productivity gains, process simplification, measurement system improvements, and equipment utilization optimization.
Partner with Test Engineering, Product Engineering, Yield Engineering, Manufacturing, Operations, Quality, and IT teams to provide technical leadership in root cause analysis, corrective action implementation, engineering reviews, and documentation of best practices and knowledge transfer materials.

Benefits

paid vacation time
paid sick leave
medical/dental/vision insurance
life, accident and disability insurance
tax-advantaged flexible spending and health savings accounts
employee assistance program
other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity
tuition reimbursement
transit
the Applause Program
employee stock purchase plan
the WD Savings 401(k) Plan