Principal, Thermal Design Engineer

Celestica•San Jose, CA

1d•Onsite

About The Position

Join a world-class engineering group at Celestica focused on developing high-end cooling solutions for advanced systems, including AI servers, switches, accelerators, and rack-level infrastructure. We thrive in a highly collaborative, supportive environment where pushing the leading edge of thermal technology is a shared mission. Your Impact Lead Thermal Strategy: Spearhead new technology investigations and drive innovation in advanced electronics cooling. Solve Complex Challenges: Leverage your deep data center expertise to immediately address and resolve critical customer thermal needs. Shape the Future: Define and execute Celestica’s mid-to-long-term strategic roadmap and capabilities for global thermal systems.

Requirements

Data center system cooling
Liquid cold plates, manifolds, and flow networks.
Thermal simulation
Supply chain interaction
Heat transfer theory and its application to electronics cooling
Systems design understanding of the entire heat path: chip to rejection to the environment.
Leading other engineers
10+ years of experience in thermal systems engineering, preferably with direct experience in liquid cooling for high-performance computing or data
Hands-on experience with manufacturing processes, supplier management, and technology transfer
Strong understanding of liquid cooling–specific reliability, safety, and performance challenges

Responsibilities

Lead designs, conduct detailed analyses, set design strategy, and join department planning.
Guide design engineers in complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing.
Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs.
Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products.
Conceive and implement ways to enhance and extend operation of heat transfer hardware.
Consider the thermal aspects of chip packaging technologies.
Apply best-in-class fluid flow and extended surface geometry to cool high heat flux chips.
Determine and consider the effects of contact resistance and the use of Thermal Interface Materials.
Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost.
Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates.
Plan your work, and that of others, to achieve full required performance, and stay on schedule to support overall product development.
Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications.
Advise and hekp with hands-on lab tests of equipment from component to rack and facility level for design and model validation.
Guide the documentation of thermal test plans, help devise test stands, metrology, instrumentation, and experiment methodology.
Analyze test data to draw inferences about the equipment tested.
Apply statistical methods as required to maximize utilization of data and test usefulness.
Work with multi-disciplinary groups to define system requirements and design products.
Work with cross-functional teams to identify root causes of system performance.