Principal System/Rack Mechanical Engineer

Astera Labs•Research Triangle Park, NC

3d•$170,000 - $210,000•Onsite

About The Position

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com. We are seeking a Senior Principal Mechanical Engineer to lead mechanical architecture and system integration across next-generation AI platforms, optical networking systems, and rack-scale infrastructure solutions.

Requirements

Bachelor's, Master's, or PhD in Mechanical Engineering or related discipline.
15+ years of experience in mechanical design and system integration.
Proven experience leading mechanical architecture for: Servers, Networking Platforms, Storage Systems, AI Infrastructure, Data Center Hardware.
Expertise in: Sheet Metal Design, Structural Analysis, Tolerance Analysis, Mechanical Packaging, Cable Management, System Integration, Design for Manufacturing (DFM), Design for Assembly (DFA).

Nice To Haves

Experience with Open Rack and OCP architectures.
Experience supporting rack-scale AI infrastructure.
Familiarity with PCIe Scale-Up and UALink architectures.
Experience with Ethernet and optical networking systems.
Knowledge of fiber connectivity solutions and optical packaging.
Experience supporting NPO and CPO platforms.
Experience developing liquid-cooled infrastructure.
Experience working directly with ODM/JDM manufacturing partners.

Responsibilities

Define mechanical architecture from device-level products through complete rack-scale AI systems.
Develop scalable mechanical designs supporting future generations of AI infrastructure.
Establish system-level design requirements balancing: Performance, Reliability, Manufacturability, Serviceability, Cost, Sustainability.
Own mechanical architecture for: GPU Compute Platforms, PCIe Scale-Up Switch Platforms, UALink Switch Platforms, Optical Connectivity Systems, Rack Controllers, Rack Enclosures, Cable Management Systems, Open Rack Platforms.
Drive solutions that support high-density AI computing deployments.
Define rack layouts and mechanical interfaces.
Develop scalable rack architecture standards.
Drive mechanical integration of: Compute systems, Switch platforms, Power shelves, Cooling infrastructure, Optical connectivity, Management systems.
Support future multi-rack AI factory deployments.
Develop mechanical solutions supporting: Fiber Infrastructure, Optical Engines, Silicon Photonics, NPO Architectures, CPO Architectures, Rack-to-Rack Optical Connectivity.
Address challenges associated with: Cable routing, Bend radius management, Serviceability, Fiber protection, Field replaceability.
Partner with Thermal Engineering teams to: Optimize airflow architecture, Develop liquid cooling mechanical solutions, Support cold plate integration, Define coolant distribution infrastructure, Improve overall system cooling efficiency.
Define manufacturing-ready mechanical solutions.
Support supplier and ODM engagement.
Drive cost optimization efforts.
Establish assembly and service procedures.
Improve production scalability and operational efficiency.
Work closely with: Electrical Engineering, Thermal Engineering, Power Architecture, Silicon Development, Product Management, Manufacturing Teams to ensure complete system integration and design alignment.
Work directly with Accton, Hyve, Wistron, Quanta, Gigabyte, and other ODMs to: Define mechanical requirements, Review platform designs, Resolve integration challenges, Drive Open Rack implementation, Support design validation and manufacturing readiness.