Principal Product Engineer

Renesas Electronics•Palm Bay, FL

About The Position

This is an experienced Principal Product Engineer role within the Renesas Hi-Reliability group, supporting advanced IC products for space and harsh-environment applications. The role will help guide complex semiconductor products from development through characterization and production readiness, requiring strong semiconductor NPI experience, hands-on lab capability, technical leadership, and a continuous improvement mindset to support high-reliability product release.

Requirements

10+ years of experience executing new product development within the semiconductor industry.
Strong product engineering experience across IC characterization, validation, test, debug, and production release.
Hands-on lab proficiency using oscilloscopes, multimeters, bench power supplies, and other standard semiconductor lab equipment.
Familiarity with Automated Test Equipment platforms such as ETS-64, microFLEX, UltraFLEX, Advantest 93K, or similar ATE systems.
Strong statistical data analysis capability using tools such as JMP, Spotfire, or similar semiconductor data analysis platforms.
Experience with bench-to-ATE correlation, characterization data analysis, electrical specification validation, and product performance review.
Working knowledge of semiconductor NPI processes, including product engineering, test engineering, applications engineering, assembly/package engineering, reliability engineering, and manufacturing readiness.
Strong communication and interpersonal skills with the ability to lead cross-functional product development teams and communicate technical risks, results, and recommendations clearly.
Bachelor's degree in Electrical Engineering required.

Nice To Haves

Experience with radiation-hardened ICs, Hi-Rel semiconductor products, space electronics, or harsh-environment applications preferred.
Familiarity with MIL-PRF-38535 / MIL 38535 or similar high-reliability semiconductor standards preferred.
Master's degree in Electrical Engineering preferred.

Responsibilities

Lead product engineering activities for new product development of radiation-hardened ICs used in space and harsh-environment applications.
Serve as the cross-functional technical hub between IC design, radiation effects, applications engineering, test engineering, assembly and package engineering, reliability engineering, and manufacturing teams.
Drive product development milestones throughout the semiconductor NPI lifecycle, helping ensure alignment across technical functions and project stakeholders.
Characterize IC designs to verify compliance with electrical specifications, product requirements, and high-reliability performance expectations.
Perform hands-on bench testing using standard semiconductor lab equipment to support device characterization, validation, debug, and ATE correlation.
Analyze characterization data and provide technical insights related to product performance, margin, yield, quality, reliability, and manufacturability.
Support bench-to-ATE correlation and partner with test engineering teams on test strategy, test development, debugging, and production readiness.
Collaborate with package engineering, assembly engineering, and reliability teams to integrate product requirements into a final manufacturable solution.
Support high-reliability product development practices for space-grade or harsh-environment semiconductor products.
Contribute to continuous improvement initiatives within the Hi-Rel Product Engineering and Test Engineering teams, particularly around NPI execution, ATE readiness, data analysis, and product release processes.
Communicate technical status, risks, results, and recommendations clearly to cross-functional engineering teams and leadership.