Principal Power Electronics Packaging Engineer

Helion • Everett, WA

6d • Onsite

About The Position

The switching systems in a commercial fusion generator will need to handle extreme pulsed currents in mass-manufacturable package. We are looking for someone to design what the next generation of packaging looks like, working ahead of where technology currently is and defining what it needs to become.

Requirements

• Hands-on experience with power electronics packaging for high-current or high-voltage applications
• Strong thermal engineering fundamentals; comfortable with modeling and bench validation
• Experience with SCRs, diodes, or similar power semiconductors in demanding environments
• Proven experience translating research into tangible hardware and products

Responsibilities

• Lead development of next-generation thermal management and packaging architectures for high-current switching components
• Work across packaging geometry, materials selection, and cooling system design to push the performance ceiling of pulsed power switch assemblies
• Collaborate with internal teams and industry partners to accelerate development of packaging solutions
• Build test setups to validate thermal and electrical performance under realistic pulsed conditions and use that data to drive iteration

Benefits

• Medical, Dental, and Vision plans for employees and their families
• 31 Days of PTO (21 vacation days and 10 sick days)
• 10 Paid holidays, plus company-wide winter break
• Up to 5% employer 401(k) match
• Short term disability, long term disability, and life insurance
• Paid parental leave and support (up to 16 weeks)
• Annual wellness stipend

What This Job Offers

• Job Type: Full-time
• Career Level: Principal
• Education Level: No Education Listed