Principal Plating Engineer

Arizona State University•Mesa, AZ

3d•Hybrid

About The Position

The Advanced Electronics and Photonics Core Facility seeks a qualified candidate for a Principal Plating Engineer position. The candidate will mainly be focused on electroplating processing and will be expected to assist or provide backup to other areas. Primary areas of responsibility will include electroplating process development on our forthcoming 300mm wafer plating system as well as ownership of associated chemical metrology systems. As part of a multi-disciplinary team, you will interact with individuals responsible for areas such as device physics, deposition, etching, photolithography, and electrical test to ensure robust electroplating processes that meet the precise physical and electrical requirements for our customers. As part of the AEP Core operations team, you will maintain the electroplating process area by supporting operations and increasing equipment up time, responding to production issues, implementing solutions, reducing costs, and improving yields. In this position, you will support existing processes, develop new processes, identify process and material improvements, and develop intellectual property. You will also use statistical process controls and data analysis to support and monitor the performance of the equipment. Customer service is an integral part of the Principal Plating Engineer position. The candidate will be interacting directly with a wide variety of students, faculty, and other professionals to provide services as requested. Skill in communicating technical ideas in a positive and patient manner is a must. This position is funded by DoD and requires candidates to meet the definition of US person as defined in as defined by 22 C.F.R. § 120.62 and 15 C.F.R. § 772.1.

Requirements

Bachelor's degree and seven (7) years of experience appropriate to the area of assignment/field; OR, Any equivalent combination of experience and/or training from which comparable knowledge, skills and abilities have been achieved.
US person as defined in as defined by 22 C.F.R. § 120.62 and 15 C.F.R. § 772.1.

Nice To Haves

Master’s degree in engineering or related field and seven (7) years of engineering or related experience including responsibility for tool and process requirements; OR, any equivalent combination of experience and/or education from which comparable knowledge, skills and abilities have been achieved.
MS in Chemical Engineering, Materials Engineering, Physics or related discipline
Demonstrated understanding of the operation and maintenance of electroplating processing equipment
Strong interpersonal, written and verbal communication skills
Strong customer service skills
Computer knowledge used for documentation and analysis.
Demonstrated strong mechanical aptitude and experience with statistical software packages such as JMP or Minitab.
Demonstrated experience with active matrix TFT processing and amorphous-silicon processes.
Demonstrated experience with semiconductor advanced packaging processing.
Experience with many disciplines including etching, deposition, cleaning, and other thin film processing.
Equipment maintenance experience.

Responsibilities

Maintain electroplating equipment by supporting operations, increasing equipment up time, responding to production issues, keeping the equipment under statistical control, and reducing costs.
Assist students, faculty, and other professionals with service requests
Recommend, scope, and assist in the procurement and installation of future equipment into the Core.
Cross-train in other areas to provide backup and assistance as needed.
Write procedures to help students and other users safely use the equipment.
Provide supervision and guidance to the users of the Core.
Provide supervision to junior engineers.
Regular activities include ability to quickly change priorities which may include and/or are subject to resolution of conflicts.
Ability to clearly communicate and exchange accurate information to perform essential duties.