Principal PCB Engineer – Datacenter / High-Speed Systems

Qualcomm•San Diego, CA

1d•$201,600 - $302,400

About The Position

We are seeking a highly experienced PCB Engineer to drive next-generation Datacenter and High-performance computing (HPC) platforms. This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement, supporting both NPI and volume production while shaping Qualcomm’s future hardware roadmap.

Requirements

Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
Strong analytical and problem-solving skills
Data-driven decision making
Ability to communicate clearly with suppliers, internal teams, and executive leadership
Experience managing ambiguity in fast-paced NPI environments

Nice To Haves

BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
15+ years of PCB / substrate engineering experience (Datacenter / server / high-speed system preferred)
Strong understanding of High-speed design fundamentals (SI/PI, loss, impedance control)
Strong understanding of Advanced PCB fabrication processes (MLB, HDI, mSAP, build-up, lamination cycles)
Strong understanding of PCB materials (low-loss laminates/Core & PPG, Cu foil, Plating chemistry, SR, Surface Finish, etc.)
Experience working directly with PCB suppliers (fab + assembly/CM)
Proven track record in NPI builds and manufacturing issue resolution
Experience with AI accelerators / server motherboards / high-power boards (100kW+ rack architecture familiarity preferred)
Familiarity with advanced packaging interaction (SiP, substrate, bridge-based systems)
Experience driving technology co-development with suppliers
Ability to influence cross-functional and executive stakeholders

Responsibilities

Hands on experience with PCB process including defining and drive PCB design guidelines / stack-up / routing strategy for high-speed, high-layer count datacenter PCB boards
Develop and maintain DFM (Design for Manufacturability) libraries to ensure design compliance with supplier capability
Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability
Engage with PCB manufacturers (fabricators & assemblers) to understand design rule capability (trace/space, via structures, stack-up complexity, materials)
Evaluate BOM capability including advanced laminates, low-loss materials, and new technologies
Collect and analyze supplier data to validate manufacturing capability vs design requirements
Drive multi-source strategy and supplier qualification for high-volume production
Support critical NPI builds for datacenter platforms (AI/Compute PCB boards, high-power systems)
Troubleshoot PCB fabrication / assembly issues: Yield excursions, Reliability failures, Process limitations
Lead root cause analysis and implement corrective & preventive actions (CAPA)
Drive PCB technology roadmap in collaboration with suppliers: Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.), New materials (low-loss, high-Tg, ultra-thin core, glass core evolution), High layer count / ultra-high density interconnect solutions
Pioneer and implement new structures, technologies, and BOM solutions to advance Qualcomm’s platform capability
Monitor industry trends (Datacenter, AI infrastructure, high-speed PCB technology)
Perform competitive benchmarking (Hyperscalers, ODM ecosystem, etc.)
Identify emerging strategies to ensure Qualcomm remains aligned with leading-edge technology directions