Principal NPI Product Engineer

Semtech

13d•Hybrid

About The Position

Semtech's New Product Introduction (NPI) Product Engineering Team is the central engineering function behind every new product we bring to market. Our team of focused and talented engineers takes full ownership of new product development — driving each program from conception through end-of-life with a commitment to flawless execution. Working closely with all internal cross-functional teams, our engineers define and drive DfT testability requirements, test coverage, production characterization (across process, voltage, and temperature variations), ATE-to-bench correlation, cost and yield optimization, test time reduction, project logistics, and seamless transfer to full-volume manufacturing. We take pride in delivering high-quality products that exceed customer expectations and drive business success — and our versatile, results-driven team makes it happen. We are looking for a Principal NPI Product Engineer to take ownership of new product development programs — from early-stage silicon development through full production transfer. Working closely with cross-functional teams across design, validation, test, characterization, quality, and operations, you will be a key technical contributor and program driver for our high-performance optical and analog/mixed-signal IC portfolio in cutting-edge CMOS and BiCMOS technologies.

Requirements

BS in Electrical Engineering or a related field (MS strongly preferred)
10+ years of experience in semiconductor product engineering, test engineering, or design engineering
Proven ownership of silicon bring-up, characterization, and production transfer programs
Hands-on experience with ATE test development, ATE-to-bench correlation, and production test limit setting
Strong foundation in DfT and DfM principles
Proficiency with statistical analysis tools such as JMP or Excel; scripting/automation in Python, TCL, or equivalent
Excellent analytical, problem-solving, and cross-functional communication skills

Nice To Haves

Background in analog/mixed-signal or optical IC characterization (TIA, CDR, LimitAmp, high-speed SerDes)
Familiarity with high-speed ATE platforms such as Advantest or Teradyne
Experience with JEDEC reliability qualification methodologies (HTOL, HAST, ESD, latch-up)
Exposure to ATPG, MBIST, or boundary scan DFT flows
Experience engaging directly with foundry and OSAT partners

Responsibilities

Drive NPI programs from product concept through final release, ensuring product conformance to specifications and seamless transfer to full-volume manufacturing
Lead and coordinate with cross-functional teams including Design, Marketing, Validation, Test Engineering, Characterization, Quality & Reliability, Applications Engineering, and Operations
Own backend NPI development tracking through product transfer; lead milestone reviews of program logistics, timelines, and deliverables
Prepare and own NPI product release deliverables and OSAT-related manufacturing documentation, ensuring accuracy and completeness
Define and drive Design for Testability (DfT) and Design for Manufacturability (DfM) requirements for NPI products
Lead development, implementation, verification, and optimization of ATE test programs in collaboration with test engineering
Drive product characterization, correlation, and release activities to ensure adherence to product specifications and quality standards
Own finalization of datasheet specifications and ATE production test limits through data-driven, statistically validated limit-setting processes
Develop and own product characterization plans for wafer-level and bench tests across product specifications and operating conditions
Lead data analysis of ATE and bench characterization results across PVT variations, including ATE-to-bench correlation studies and process capability analysis
Drive yield modeling activities and lead DOE planning and execution to support yield analysis, test time reduction, and test optimization
Lead product validation and reliability qualification activities in collaboration with Test, Characterization, Validation, and Reliability Engineering teams
Identify yield loss Pareto opportunities and drive targeted solutions to closure
Monitor yields and quality metrics across processing steps; proactively identify and act on trends and anomalies
Review and own test coverage, test limits, and guard-band decisions
Lead failure analysis and root cause investigations for field returns and RMA cases; drive CAPA development and closure
Partner with foundry process and packaging engineering teams to resolve issues during wafer fabrication, packaging, die sort, and final package test
Identify and implement product lifecycle cost reduction and continuous improvement opportunities