Principal mmWave IC Design Engineer - TeraWave

BLUE ORIGIN•San Diego, CA

2d•$269,175 - $376,844•Hybrid

About The Position

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight! Blue Origin is pioneering the future of space-based connectivity with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This network will service tens of thousands of enterprise, data center, and government users who require reliable connectivity for critical operations. We are seeking a Principal mmWave IC Design Engineer to drive the development of state-of-the-art RF/mmWave integrated chips at Blue Origin. In this pivotal role, you will be designing cutting-edge integrated front-end circuits such as power amplifiers, low-noise amplifiers, phase shifters, variable-gain amplifiers, mixers, multipliers, and synthesizers at RF/mmWave frequencies, primarily in advanced silicon technologies. Your innovation in front-end implementation will be critical in realizing system architectures for next-generation communication networks and advancing our mission of enabling millions of people to live and work in space for the benefit of Earth.

Requirements

B.S. or Ph.D. degree in Electrical Engineering, or related technical discipline
10+ years of experience in millimeter-wave/RFIC design using SiGe, CMOS, and SOI technologies, with successful completion of multiple product lifecycles for high-volume chipsets.
Strong experience with various circuit topologies for amplifiers, mixers, switches, and synthesizers, specifically at mmWave frequencies with fully integrated on-chip implementations.
Proven expertise in the analysis and optimization of transmitter and receiver front-ends for complex modulated waveforms, including practical modeling and circuit simulations of TX/RX chains with time-sampled waveforms.
Hands-on experience in mmWave IC characterization and debugging.
Experience with analog building blocks such as operational amplifiers, bias generators, temperature sensors, LDOs, and ADC/DAC implementations.
Proficiency in EM simulations for both on-chip and package components.
Prior experience with top-level integration, including ESD, mixed-signal/mixed-mode verification, and DFM concepts.
Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Nice To Haves

Experience with beamforming front-ends and phased array implementations.
Experience in high-performance IC development using III-V technologies (e.g., GaAs, GaN).
Strategic mindset and strong communication skills, with the ability to collaborate across functions and drive complex projects to completion.
Experience mentoring early-career engineers.

Responsibilities

Design state-of-the-art RF/mmWave front-end chipsets, including power amplifiers, low-noise amplifiers, phase shifters, variable-gain amplifiers, mixers, multipliers, and synthesizers.
Partner with RF system engineers to run feasibility studies and architect RF/mmWave transmitter and receiver front-ends, translating system-level requirements into chip-level specifications.
Design and simulate on-chip electromagnetic (EM) structures and collaborate with the package engineering team on co-optimization of IC/package interfaces.
Supervise chip-level front-end integration and optimization throughout the development lifecycle and ensure successful production
Work with third-party design partners