Principal Hardware Engineer

Lumentum•San Jose, CA

4d•$134,750 - $192,500

About The Position

Our Cloud and Networking Optical Module R&D team is a world-class group of international engineers dedicated to designing and developing advanced optical transceivers and related technologies. We focus on delivering high-performance, energy-efficient, and cost-effective solutions that propel cutting-edge telecom and data center applications. As a Principal Hardware Engineer, you will be recognized as a subject-matter expert (SME) in hardware design, opto-electronic packaging, and materials science. You will mentor and guide technical leads as well as junior team members, ensuring that next-generation products are delivered on time and at the highest standards of quality.

Requirements

BS, MS, or PhD in Electrical Engineering, Photonics, Physics, Materials Science, or a related field.
Extensive background in designing high-speed electronic or optical systems, with a demonstrable track record of successful product releases and significant design ownership.
Recognized SME in hardware design, with deep theoretical knowledge and practical problem-solving skills.
Advanced understanding of industry standards (e.g., Telcordia) and best practices for product qualification.
Proficiency with high-speed integrated circuits (e.g., DSPs, drivers, TIAs) and test equipment (oscilloscopes, network analyzers, DCA, etc.).
Strong scripting ability (Python or similar) for automation and data analysis.
Demonstrated success in leading and mentoring technical teams, particularly in a fast-paced, global R&D environment.
Excellent problem-solving, communication, and collaboration skills.

Nice To Haves

Proven ability to innovate and elevate testing and analysis methodologies that enhance performance, reliability, and manufacturability.
Background bridging optical, mechanical, electrical, and materials science disciplines, fostering synergy across multiple technical areas.
Experience providing high-level guidance to technical leads and steering cross-functional projects to align with broader organizational goals.
History of championing process improvements and implementing effective solutions to drive down costs and speed up development cycles.
Comfortable operating in a globally distributed environment, effectively collaborating with teams across multiple time zones and cultures.

Responsibilities

Serve as a recognized SME in optical transceiver hardware design and development with a deep understanding of hardware theory and its application to real-world challenges.
Provide high-level guidance and mentorship to cross-functional teams, ensuring best practices are consistently implemented.
Act as a go-to expert on cost-effective opto-electronic packaging, component design, and integration strategies that meet or exceed performance and cost objectives.
Offer strategic input on complex packaging challenges and lead high-impact initiatives to optimize product reliability, manufacturability, and budgetary constraints.
Demonstrate expert knowledge of design specifications, compliance requirements, and qualification standards (e.g., Telcordia).
Provide guidance to technical leads for testing and analysis of complex hardware systems, ensuring product designs align with industry and regulatory standards.
Recognized as a SME in materials science, applying a deep understanding of material properties and behaviors to resolve complex hardware development issues.
Provide expert-level advice on material selection, testing, and analysis methodologies to support robust and reliable hardware solutions.
Lead the planning and execution of advanced testing and analysis on complex hardware systems and components, diagnosing issues swiftly and implementing innovative solutions.
Oversee continuous improvement initiatives, driving new test methodologies that elevate product performance and reliability.
Continue to own and innovate on PCB design, focusing on high power efficiency, low noise, small footprints, and seamless integration with high-speed components (e.g., DSPs, drivers, TIAs).
Collaborate closely with CAD engineers and cross-functional teams to ensure holistic design approaches.
Provide technical leadership for cross-disciplinary projects involving firmware, test, materials, and manufacturing engineers, championing effective communication and alignment.
Partner with global teams (US, Europe, Asia) to share expertise, drive continuous innovation, and deliver industry-leading products.