Principal Hardware Engineer - High Speed PCB- RUCKUS

Belden Inc•Carson, CA

11d•$135,600 - $200,000•Hybrid

About The Position

Belden connects people, information, and ideas to solve the world’s most complex connectivity challenges, turning curiosity into meaningful impact. RUCKUS Networks, a Belden brand, focuses on delivering cutting-edge solutions to create a smarter, simpler, more connected world. We are a pioneer in the wireless infrastructure market, enabling carriers and enterprises to stay ahead of the exploding demand for high-bandwidth applications and services. Our RUCKUS Smart Wi-Fi, LTE, and Switching technology redefines what’s possible in wireless network performance with flexibility, reliability, and affordability. We are looking for an experienced engineer with high-speed hardware design expertise to join our team in Sunnyvale, CA. As a member of the Ruckus's Hardware engineering team, you will be responsible for system- and board-level design of RF subcircuits based on various wireless industry standards. You will work closely with the broader Engineering team, consisting of Electrical, Mechanical and Software Engineers.

Requirements

Minimum BSEE with 5+ years of relevant experience in high-speed digital hardware design.
Must have experience in all aspects of hardware design including schematics capture, PCB layout constraint, DFM implementation, bring-up and design validations.
Must have experience in common interfaces, PCIe, 10GE, DDR4, SPI, I2C, USB, UART...
Excellent knowledge of SI and PI for high-speed designs.
Excellent knowledge of DC/DC switching power supply including PoE PSE and PD.
Strong proficiency in OrCAD, Allegro, Arena, Ms office.
Familiarity with design for compliance/regulatory testing.
Familiarity with lab equipment, logic analyzer, oscilloscope, Sifos PoE tester, thermal chamber…
Good communication skills and be able to work with all cross-function teams.
Ability to proactively lead the whole design from scratch to product.

Nice To Haves

Basic knowledge of RF and antenna.
Familiarity with main Wi-Fi SOC in the industry, like Qualcomm or Broadcom, is a big plus.
Ability to manage the 3rd party for souring components, design and/or design reviews.
Experience in ODM, JDM design and contractor manufacturer.

Responsibilities

Design, bring-up Wi-Fi AP products and accessories.
Debug and validate Wi-fi AP designs.
Investigate, present, and evaluate new hardware solutions and/or PoC.
Review and evaluate designs of outsourced projects.
Work with RF team and Antenna team to integrate designs and validate designs together.
Generate necessary documents for all categories listed above, such as PoC, PRD, HRD, HWFS, BOM, test plan, FA report…
Support compliance testing.
Sustain legacy products.