Principal Firmware Developer, HBM

Micron • Folsom, CA

1d

About The Position

As a Firmware Developer on Micron Technology’s HBM Architecture team, you will drive development and implementation of firmware and embedded software for next-generation Custom High Bandwidth Memory (HBM) products. This is a critical technical leadership role involving firmware requirements review, implementation, and validation support. You will work closely with firmware architects, SoC design and verification teams, and customers to deliver robust, scalable, and performant firmware solutions for future HBM products.

The role spans early concept and architectural pathfinding through silicon bring-up, qualification, customer enablement, and product sustainment. You will contribute to co-optimization of firmware, RTL, hardware features, and IP selections, and use FPGA prototyping and AI-assisted development workflows. The position requires a BSEE or greater and at least 10 years of relevant Engineering or Design Engineering experience. Job title and level may scale depending on experience and qualifications.

Requirements

• BSEE or greater.
• 10+ years of relevant Engineering or Design Engineering experience.
• Strong experience in embedded systems or firmware development, including low-level programming and system control.
• Proven ability to architect complex firmware systems, interfaces, and system-level enablement features for GPUs, CPUs, or TPUs in large-scale AI datacenter environments.
• Background in memory technologies such as DRAM, HBM, NAND, or related subsystem architectures.
• Hands-on experience with low-level firmware, hardware bring-up, and silicon debug workflows.
• Exposure to RAS, diagnostics, telemetry, testing, or reliability-focused firmware.
• Familiarity with high-speed interfaces and protocols, including memory controllers, PHY interaction, or SoC-level firmware integration.
• Experience working in multifunctional silicon development teams and collaborating across hardware, firmware, and architecture groups.
• Understanding of DRAM operation and JEDEC standards, with strong communication skills.
• Proficiency in applying AI and AI-enabled development workflows.

Nice To Haves

• Experience with HBM and JEDEC standards.
• Exposure to AI/ML workloads or datacenter-scale memory systems.

Responsibilities

• Analyze firmware architecture, design requirements, and customer requirements to create implementation plans.
• Deliver firmware solutions for next-generation SoC designs, including driver layers, design verification firmware, manufacturing/test firmware, and production firmware.
• Use FPGA prototyping to develop and validate firmware.
• Collaborate with HBM architecture, design, and verification teams to co-optimize firmware, RTL, hardware features, and IP selections, ensuring clean interfaces and long-term scalability.
• Provide technical leadership from early concept and architectural pathfinding through silicon bring-up, qualification, customer enablement, and product sustainment.
• Drive technical discussions with internal and external collaborators to clarify and align on key requirements and features.
• Drive innovation for future memory generations in a dynamic work environment.
• Use GenAI to develop AI-assisted development workflows.

Benefits

• Medical, dental, and vision plans.
• Programs to protect income if unable to work due to illness or injury.
• Paid family leave.
• Paid time off.
• Paid holidays.
• Additional compensation may include bonuses and equity.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal