Principal Engineer, Thermo-Mechanical

Marvell Technology•Santa Clara, CA

1d•$166,520 - $249,500

About The Position

The Advanced Packaging Technology Development team develops and qualifies advanced packaging technologies and package architectures that enable Marvell's next-generation AI, cloud, networking, silicon photonics, and co-packaged optics products. Working across product engineering, package architecture, reliability, manufacturing, customers, suppliers, and OSAT partners, the organization drives technology development, qualification, and readiness to enable strategic customer engagements and execute Marvell's long-term product and technology roadmap.

Requirements

M.S. or Ph.D. in Mechanical Engineering, Materials Science, Engineering Mechanics, or a related engineering discipline.
10+ years of thermal, thermo-mechanical, advanced packaging, or semiconductor technology development experience.
Demonstrated leadership developing thermal and thermo-mechanical solutions for advanced semiconductor packages and heterogeneous integration platforms.
Deep understanding of heat transfer, structural mechanics, material behavior, package reliability, and failure mechanisms.
Experience with advanced cooling technologies including TIMs, vapor chambers, liquid cooling, cold plates, immersion cooling, or package-integrated cooling solutions.
Extensive experience with thermal and thermo-mechanical simulation tools such as ANSYS Mechanical, Icepak, Fluent, Abaqus, COMSOL, or equivalent platforms.
Proven experience correlating simulations with laboratory measurements, package characterization, and reliability data.
Experience driving technology development with OSATs, material suppliers, cooling vendors, and cross-functional engineering teams.
Strong written and verbal communication skills with the ability to influence technical decisions across engineering organizations.

Nice To Haves

Development experience supporting AI accelerators, networking products, silicon photonics, co-packaged optics, or other high-performance computing applications.
Advanced packaging technologies including 2.5D/3D integration, chiplets, heterogeneous integration, hybrid bonding, and advanced substrates.
Development of thermal design methodologies, design rules, or technology roadmaps for advanced semiconductor packaging.
Experience working directly with customers to evaluate thermal requirements and technology solutions.
Record of technical publications, patents, or industry leadership related to advanced packaging, thermal management, or reliability.

Responsibilities

Lead development of thermal and thermo-mechanical technologies for advanced semiconductor packaging platforms.
Define thermal architecture requirements and technology strategies supporting future AI, networking, silicon photonics, and co-packaged optics products.
Develop and evaluate advanced cooling solutions including TIMs, vapor chambers, liquid cooling, package-integrated cooling, and emerging thermal technologies.
Perform thermal, structural, and thermo-mechanical analysis and establish simulation methodologies for advanced package development.
Correlate simulation models with laboratory measurements, package characterization data, and reliability results to improve design accuracy and predictive capability.
Investigate thermal and mechanical failure mechanisms including warpage, stress, deformation, delamination, fatigue, and material degradation.
Work closely with package architects, product engineers, reliability teams, customers, suppliers, and OSAT partners to develop and qualify new technologies.
Drive technology selection, design tradeoff analysis, and technical decision-making across multiple product programs.
Mentor engineers and contribute to the development of thermal design practices, simulation workflows, and engineering standards.
Represent Marvell in technical engagements with customers, suppliers, industry consortia, and external partners as needed.