Principal Engineer, Research Science Engineering
About The Position
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. We are seeking an experienced process integration engineer with expertise in silicon device fabrication. You will be a lead contributor to the definition of new process technology integration specifications and layout design rules for ADI’s next-generation mixed-signal and BCD technologies. You will be interface between device engineers and fab process engineers and provide process integration solutions to device engineers. You will be responsible for identifying the root cause of yield and reliability issues incurred during the process development. You will also lead process and product qualification efforts for new technologies and for technologies transferring between different fabs.
Requirements
- In-depth knowledge of FEOL/BEOL processes
- Strong knowledge of process DOE – screening /process corner
- Demonstrated ability to solve unique or complex integrated problems across processing modules
- Hands-on experience in test structure design, layout, test, and data analysis
- Knowledge of device physics and Si reliability characterization methodologies
- Understand the trade-off between cost, performance, yield, reliability.
- Strong project management skills - plan effectively, drive schedules, meet critical deadlines
- Excellent communication and collaboration skills. Expect to work closely with cross functional teams
- M.S./Ph.D. in Electrical Engineering, Physics, Material Science, or equivalent field with 7+ years semiconductor industry experience
Nice To Haves
- Knowledge of packaging technology is a plus
Responsibilities
- Lead contributor to the definition of new process technology integration specifications and layout design rules for ADI’s next-generation mixed-signal and BCD technologies.
- Interface between device engineers and fab process engineers and provide process integration solutions to device engineers.
- Identify the root cause of yield and reliability issues incurred during the process development.
- Lead process and product qualification efforts for new technologies and for technologies transferring between different fabs.
Benefits
- medical, vision and dental coverage
- 401k
- paid vacation, holidays, and sick time
- discretionary performance-based bonus
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What This Job Offers
Job Type
Full-time
Career Level
Principal
