Principal Engineer - Process

Microchip Technology Inc. • Beverly, MA

1d • Onsite

About The Position

Microchip is seeking an experienced and proactive Process Engineer to lead the introduction of our next-generation Chip Scale Atomic Clock (CSAC). CSAC is the world's most innovative low-power atomic clock, first introduced in 2011. Microchip’s next-generation CSAC will set new standards for performance and is anticipated to be deployed worldwide in numerous commercial, industrial, and high-reliability applications. We are seeking a proactive, enthusiastic, and assertive Process Engineer who enjoys working within a team environment. In this role, you will actively contribute to the engineering efforts required for the manufacture of our Chip Scale Atomic Clock. The position requires both electrical and mechanical engineering competencies and will operate within various engineering disciplines. Role functions will include manufacturing support, manufacturing, materials analysis & definition, production analysis, and process advancement. This role is an experience-rich opportunity for a senior process engineer to work alongside a team of experienced cross-discipline engineering technicians and R&D Engineers. In this fast-paced collegial environment, the selected candidate will quickly integrate within a role characterized as having high levels of autonomy, immersed within the company’s broad-based manufacturing environment that has the support of several internal foundries, assembly plants, testing facilities, and FA resources.

Requirements

• Experience in Design and Manufacturing in a new product introduction (NPI) role.
• Fluency in utilizing appropriate best-practice engineering principles.
• Familiarity with statistical methods and concepts such as SPC, ANOVA, 8D, Gage R&R, DOE, 5 Why’s, Fishbone, 6 Sigma, 6S, Lean Value Stream, etc.
• Experience with hardware bill of materials (BOMs), process documentation, and assembly and test processes.
• Ability to build strong relationships, manage multiple projects simultaneously, and lead cross-functional teams.
• Experience with complex new product introduction programs, with a proven ability to multitask, analyze opportunities, define successful approaches, and proactively solve problems.
• Ability to clearly communicate project requirements and schedules, both verbally and in writing.
• 7.5 - 9 years of relevant experience with a BS degree, or 5 - 6 years with a MS degree.
• MS in Electrical, Mechanical, Chemical, Manufacturing, or Industrial Engineering strongly preferred.
• Experience working internationally across multiple time zones and cultures.
• Ability to travel up to 10% domestically or internationally as required.
• Team player
• Self-starter
• Strong work ethics
• Flexible/ adaptable to changing priorities.
• Inclusive embraces diversity and embodies Microchip guiding values.
• Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).

Responsibilities

• Participation in the design, trade studies, and prototyping of the product
• Develop the processes necessary to release our next generation CSAC along with the Research, Engineering, and Operations teams.
• Create detailed SOP for different equipment/ processes, including solder reflowing, sealing, wafer bonding, wafer dicing, evaporation, and sputtering
• Collect and analyze process data to identify trends and make data-driven decisions
• Utilize control systems to monitor and adjust processes in real-time, ensuring optimal operating conditions
• Provide technical support and training to production teams and end-users for different processes
• Continuously improve and optimize processes in the physics package product line
• Coordinate with suppliers and manufacturers for components procurement, including wafers, VCSELS, photodiodes, solder preforms, thermistors, and LCCs
• Apply lean manufacturing or Six Sigma methodologies to optimize existing processes for efficiency and cost-effectiveness
• Establish quality control guidelines, develop testing methods, and ensure compliance with safety and quality standards
• Ensure compliance with industry standards, environmental regulations, and company policies
• Provide guidance and training to junior engineers and other staff on process improvements and developments
• Work on the development and implementation of automated manufacturing processes for assembling semiconductor dies

Benefits

• Health benefits that begin day one
• Retirement savings plans
• Industry leading ESPP program with a 2 year look back feature

What This Job Offers

• Job Type: Full-time
• Career Level: Senior