Principal Engineer Package Concept (Module)
Infineon•Andover, MA
•$156,900 - $215,700•Onsite
About The Position
At Infineon, we’re powering AI – from the grid to the core, today and in the future – delivering innovative solutions and redefining what’s possible in the world of data centers and beyond. As our hashtag#PoweringAI teams continue to grow, we’re looking for talented professionals eager to be part of this exciting journey.
Requirements
- Technical background, e.g. Degree in Physics or Electronics
- 6 years practical experience in assembly technologies with detailed knowledge of Back End processes and materials and their dependencies laminate design/ materials/ processes
- Background knowledge of SMT related technologies
- Experience with typical package design tools (e.g. Autocad/ Cadence)
- Very good communication and presentation skills
Responsibilities
- Define package concepts for AI power supply products with focus on high-performance computing modules
- Validate package concepts through simulation and hardware demonstrators in cooperation with Back End development, product development and system architects
- Align new ideas and concepts with Back End development (in-house + OSAT) and initiate assembly projects
- Follow up and support package development projects until final release of the product
- Identify new development topics and incorporate them into the package roadmap
- Support our customers with package specific questions
- Stay up to date on package solutions through continuous market screening and competitor analysis
- Identify business opportunities enabled by new technologies and concepts
Benefits
- Employees will be eligible to participate in an incentive plan.
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What This Job Offers
Job Type
Full-time
Career Level
Principal
