Northrop Grumman Mission Systems is looking for you to join our team as a Principal Industrial Engineer for our Advanced Packaging Technology µ-Line based in Apopka, Florida. Northrop Grumman’s semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronics and providing leading-edge technology development. The Apopka Florida wafer bumping µ-Line supports flip chip, 2.5D, and 3D packaging for internal and external production customers as well as emerging technology programs. The line provides a range of bump compositions and processes that include photo, sputter, electro-plating, AOI, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm wafers. The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing. The Principal Industrial Engineer is an integral part of the day-to-day operations and routinely works alongside engineering, production and many other organizations here in Apopka, FL. This is a team that comes together to learn, collaborate, and overcome challenges in a fast-paced environment. We are looking for applicants that enjoy working and learning from their peers and are passionate about making a positive difference.
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Job Type
Full-time
Career Level
Principal