PRINCIPAL ENGINEER - HIG HBM PSE

Micron TechnologyFolsom, CA
$145,000 - $247,000Onsite

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role focuses on developing and implementing HBM Component Validation coverage across structural and functional test flows, ensuring full validation coverage at each product landmark with zero validation escapes. The engineer will translate DRAM/HBM design intent and architecture into practical validation coverage and test cases, and contribute to the validation of new and high-risk product features in collaboration with Design, Design Validation, and Systems Engineering teams. Responsibilities include preparing clear validation summaries, providing technical feedback, reviewing design specifications, schematics, and datasheets, and performing root-cause analysis of electrical failures.

Requirements

  • Bachelor’s or Master’s degree in Electrical/Computer Engineering or a related field, with a minimum of 6 years of relevant experience — preferably in the memory semiconductor industry.
  • Strong proven understanding of DRAM and HBM architecture, operation, and design concepts.
  • Solid experience reading and debugging circuit schematics to isolate failure causes linked to develop aspects.
  • Extensive experience in post-silicon product validation and debug, including root-cause and electrical failure analysis.
  • Proven experience programming with Linux, Python/C/C++, Verilog, UVM, and version control systems (git, svn, Perforce).

Nice To Haves

  • Experience developing validation coverage and supporting feature or design-issue validation for HBM or advanced DRAM products.
  • Hands-on experience with lab equipment including oscilloscopes and logic analyzers, and with high-speed I/O and signal-integrity validation.
  • Experience validating products spanning hardware, firmware, and software components.
  • Experience applying generative-AI or agentic tooling to semiconductor design, test, or validation workflows.
  • Experience coaching engineers and collaborating with multi-functional teams across multiple sites and time zones.

Responsibilities

  • Develop and implement HBM Component Validation coverage across structural and functional test flows, supporting full validation coverage at each product landmark with zero validation escapes.
  • Translate DRAM/HBM design intent and architecture into practical validation coverage and test cases.
  • Contribute to validation of new and high-risk product features, working with Design, Design Validation, and Systems Engineering.
  • Prepare clear validation summaries and provide technical feedback to the team and management on issues, risks, and mitigations.
  • Review design specifications, schematics, and datasheets; provide design feedback and represent the Product Engineering perspective in Design and Verification reviews.
  • Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms and advise validation and debug direction.
  • Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues.
  • Apply automation and modern tooling (Python/C/C++, Verilog/UVM simulation, version control) to improve detection efficiency and cycle time.
  • Adopt agentic and LLM-based workflows — such as automated code generation and review, and failure-analysis / root-cause acceleration — to improve efficiency, quality, and turnaround duration.

Benefits

  • Choice of medical, dental and vision plans
  • Benefit programs that help protect your income if you are unable to work due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
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