Principal Chipset Project Engineer – Thermal/Limits for Personal Computer (PC)

Qualcomm • San Diego, CA

8d

About The Position

Qualcomm’s Compute Chipset Project Engineering team is responsible for the planning and execution of industry leading Compute Chipsets through all phases from concept to commercialization. A Compute Chipset comprises multiple chips that together perform the functions of a compute device (such as Application Processor, PMICs, Audio, Connectivity, Modem), as well as the associated software, firmware and reference hardware.
We are seeking a Principal Chipset Project Engineer – Thermal/Limits for Personal Computer (PC) to lead the thermal and limits strategy across the compute product portfolio through all phases from concept to commercialization. Responsibilities include defining system thermal budgets, defining methodologies and tools to analyze and predict thermal behavior, modeling of thermals and thermally constrained performance, influencing designs and planning features, defining and tuning system limits, as well as to provide customer guidance on thermal targets and solutions. This lead will be responsible for extracting the highest thermally constrained system performance possible out of systems with fixed product constraints. Works closely with domain and IP specific engineering leads, Project Engineers, Product Management, and Program Management. Role also requires a strong engagement with OEMs and ODMs. Responsible for clearly communicating thermal goals, strategy, and status to executives and chipset teams. Works in a highly matrixed environment. This role frequently requires working with others to fulfill job responsibilities without direct authority.

Requirements

• Bachelor's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 8+ years of Electrical, Computer, or Software Engineering or related work experience.
• OR Master's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 7+ years of Electrical, Computer, or Software Engineering or related work experience.
• OR PhD in Electrical Engineering, Computer Science, Computer Engineering, or related field and 6+ years of Electrical, Computer, or Software Engineering or related work experience.
• 8+ years of experience in one or more areas of semiconductor product development.
• 5+ years in a technical leadership role.

Nice To Haves

• Master's Degree or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or related field.
• 10+ years of experience in one or more areas of semiconductor product development (e.g., system design, architecture, silicon design and validation, SW development and test).
• 8+ years of experience in a thermal systems role, with a strong preference for PC thermal systems experience.
• 4+ years of experience working in a large matrixed organization.
• 3+ years of work experience in a role requiring interaction with executive leadership.
• Prior experience in the PC industry.

Responsibilities

• Leverage expert knowledge to help guide design and architectural choices for the chipsets, platforms, and software to extract the highest thermally constrained performance while meeting product constraints including cost and size.
• Drive methodology and tool development to analyze and predict thermal behavior, assess performance impact, and assist thermal/power/performance tuning.
• Evaluate new and novel thermal solutions.
• Assess impact of system component selection on thermals.
• Influence system limits management feature set and establish best practices to tune for thermal management.
• Oversee the resolution of all thermal related issues across the chipsets.
• Interacts with customers frequently, providing guidance on thermal targets and support on thermal debug and tuning.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal
• Number of Employees: 5,001-10,000 employees