Principal Assembly Process Development Engineer

RTX•Andover, MA

17h•Onsite

About The Position

An exciting opportunity exists for a seasoned and passionate Principal Assembly Process Development Engineer working around Raytheon’s industry leading RF technology at our RF Microelectronics/Module Design & Foundry Services (RFMicro) department. The RFMicro department designs, fabricates, and tests state-of-the-art Monolithic Microwave Integrated Circuits (MMICs) in our on-site foundry. These chips then get assembled into custom modules to support multiple programs and enhance the capabilities of next generation radar systems. Your efficient and effective communication skills with peers, management, and engineering customers, plus your strong ownership, accountability, and commitment to schedule and goals are the keys to success for this role. You will have the opportunity to work closely with a team of multi-disciplined and talented engineers to build technology-enriched assembly prototypes. You will interact with internal customers, as well as suppliers to review tradeoffs to meet the project goals. You will work alongside other seasoned engineers and be a mentor to lab technicians and more junior engineers around our two prototyping labs. Your subject matter technical expertise is critical, so are your leadership and your teamwork spirit. The role requires knowledge of high density microelectronic packaging designs including Interposers, organic substrates, wafer and chip bumping and general knowledge in areas of electronic components/devices such as ASICs and FPGAs, design of electronic packaging chassis and structures, interconnects, and thermal management design of high-density electronic systems and electronic enclosures. The successful candidate will have the ability to bring new and fresh ideas to the team, with opportunities to explore research and innovation areas in a collaborative and fun team environment. Additionally the candidate is expected to follow established procedures in creation of technical data package work products, while working closely with program management and functional supervision to ensure the overall design objectives are met.

Requirements

Typically requires a Bachelor’s Degree in a Science, Technology, Engineering & Math (STEM) Field
A minimum of Eight (8) or more years of relevant experience (An advanced STEM degree could count for 3 years of experience) qualifying and implementing cutting edge materials, fabrication techniques, and understanding of relevant materials used in semiconductor manufacturing and packaging
The ability to obtain and maintain a US security clearance. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance

Nice To Haves

A Master’s degree or PhD. in a Science, Technology, Engineering & Math (STEM) Field
Experience and familiarity with selection and oversight for semiconductor wafer processing and finishing (plating, bumping, dicing)
Expert experience in any or all of the following: manual and auto wire/ribbon bonders, die attachment, solder reflow, wet and dry cleansing practice, automated die and SMT component placement tools, automated adhesive dispensing tools, screen printers
Ability to perform circuit layout design using 2D CAD tools
Strong background in electrical and mechanical engineering design
Innovative attitude to apply towards research and development of new technologies
Strong background in development, documentation, fabrication, assembly, and test/delivery of military/defense and/or commercial state-of-the-art electronic products
Experience with designing electronics for extreme environmental requirements and design constraints
Excellent interpersonal and multi-tasking skills
Excellent written and verbal communication skills
Ability to work independently and in a team environment, including as a leader of small teams
Current DoD Secret level security clearance

Responsibilities

Develop advanced microelectronics packages including 3DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital and mixed-signal products
Leverage industry-leading manufacturing and novel materials to achieve new levels of electro-mechanical performance and reliability
Own prototyping jobs in the assembly labs; be a doer, a project manager, and a team player, managing multiple jobs with varying priorities
Work with a cross-functional team of module designers, layout engineers, project leads, and manufacturing engineers
Manage lab equipment’s maintenance, calibration, and upkeep, and support lab audits
Mentor and train more junior teammates
Advocate resource capabilities, present on symposiums, enable opportunities from inside and outside home business unit