Cadence is hiring a Principal AI Forward Deployment Engineer to embed with strategic semiconductor customers and operationalize Cadence's AI and agentic solutions across their end-to-end silicon design flows. This is a senior, customer-facing applied-AI role for an experienced chip-design practitioner who can translate front-end, physical-design, and methodology workflows into concrete, measurable productivity wins powered by flagship LLMs and Cadence AI tooling. You will be the trusted technical lead at the customer who turns 'AI for chip design' from a slideware promise into a deployed, adopted, and ROI-positive reality. Customers are racing to apply LLMs and agentic AI to RTL, verification, implementation, and signoff - but they need a partner who deeply understands both their tape-out flows and how to wield modern AI systems. This role owns the last mile: taking Cadence AI products (AgentStack, BU Super-Agents, Cadence.AI / JEDAI platform, Cerebrus, Verisium, Allegro X AI, etc.) and making them work inside the customer's actual methodology, PDKs, compute fabric, and security boundaries. Success here directly accelerates customer tape-outs, expands Cadence AI footprint, and feeds product roadmaps with real-world signal.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Job Type
Full-time
Career Level
Principal
Education Level
No Education Listed