Photonics IC Top Level Integration Engineer

Advanced Micro Devices, Inc•Markham, ON

4d•Hybrid

About The Position

We are seeking a Photonic Integration Engineer with expertise in photonic integrated circuit (PIC) implementation, physical design, verification, and packaging integration. In this role, you will contribute to the development of scalable physical design methodologies, verification flows, and automation frameworks that support successful product tapeouts and high-volume manufacturing. You will work across photonic, electrical, and packaging domains to help enable robust integration of complex mixed-signal and optical systems while supporting efficient design and signoff processes.

Requirements

Experience in photonic integrated circuits, semiconductor physical design, and design automation.
Solid understanding of how photonic devices, electronic circuits, and packaging technologies come together in integrated systems.
Contribution to top-level chip integration, physical implementation, and signoff activities.
Collaboration with photonic design, electrical design, process technology, and packaging teams.
Development of automated layout generation methodologies.
Improvement of verification workflows.
Ensuring manufacturability, reliability, and performance across electro-photonic products.

Nice To Haves

Experience in photonic integrated circuit (PIC) design, physical implementation, and top-level integration in production or advanced R&D environments.
Experience with physical design and implementation tools such as Cadence Innovus, Virtuoso, and related semiconductor design environments.
Experience developing script-based layout generation and design automation frameworks using Python, Julia, TCL, SKILL, or equivalent programming languages.
Understanding of physical verification methodologies, including DRC, LVS, ERC, and photonic verification flows.
Familiarity with EM/IR, power integrity, reliability, and ESD verification.
Knowledge of silicon photonics technologies, photonic device integration, and electro-photonic system architectures.
Understanding of advanced packaging technologies, including co-packaged optics, optical module integration, fiber attach methodologies, thermal management, and heterogeneous integration.
Experience collaborating with photonics, electrical, packaging, process, and manufacturing teams.
Exposure to silicon or photonic product tapeouts is considered an asset.
MASc or PhD in Electrical Engineering, Photonics, Optics, Applied Physics, Semiconductor Engineering, or a related discipline preferred.

Responsibilities

Contribute to the top-level integration and physical implementation of photonic integrated circuits (PICs), electro-photonic subsystems, and co-packaged optical solutions.
Develop and maintain script-based layout generation and physical design automation frameworks using Python, Julia, SKILL, TCL, or equivalent scripting languages.
Support full-chip physical verification and signoff activities, including DRC, LVS, ERC, and photonic verification flows.
Perform and analyze EM/IR, power integrity, reliability, and ESD verification.
Collaborate with photonic device engineers to integrate waveguides, modulators, detectors, couplers, and other optical building blocks into production-ready layouts.
Work with analog, mixed-signal, RF, and digital design teams to support electrical and photonic system integration.
Assist in developing and optimizing physical design methodologies, floorplanning strategies, hierarchical integration flows, and tapeout processes.
Support package-aware design and verification activities, including optical packaging, fiber attach strategies, thermal management, signal integrity, and co-packaged optics architectures.
Contribute to automation infrastructure, verification methodologies, and design best practices across photonic and electrical design environments.
Support silicon bring-up, root-cause analysis, and correlation of physical design assumptions with silicon and module-level test results.