Photonic Integrated Circuit Fabrication

MIT Lincoln Laboratory•Lexington, MA

4d•$145,200 - $220,000•Onsite

About The Position

The RF and Integrated Photonics Group (Group 85) is committed to advancing technologies in the national interest by harnessing novel RF and photonic capabilities. The group’s work encompasses everything from foundational research into materials and components to the development of complete RF and photonics systems. Key application areas include classical and quantum sensing and computing systems, as well as laser, radar, communications, and electronic warfare technologies. Within the group, the integrated photonics area focuses on developing photonic integrated circuits (PICs) and active photonic devices for classical and quantum applications including: microwave photonics; ion trap quantum computing; quantum sensing and communication; advanced laser, modulator, photodetector and other device development; and non-linear photonic applications. These efforts are supported by state-of-the-art on-site fabrication tools, close partnerships with universities and industry, extensive test and measurement infrastructure, and daily collaboration with the broad array of engineers and scientists within Lincoln Laboratory. The group seeks a highly motivated, detail-oriented, curious, and driven scientist or engineer to join our integrated photonics fabrication team. The successful candidate will join a close-knit, dynamic team pushing the forefront of photonic integrated circuit (PIC) platform and system development. The successful candidate will play a central role in developing PIC fabrication processes for monolithic and hybrid-integrated circuits for both classical and quantum applications. Work will focus on our 200 mm PIC fabrication platforms and will primarily be completed in our in-house Microelectronics Laboratory with support from a full team of process and equipment technicians and area engineers. Other hands-on process activities will be performed in our compound semiconductor and auxiliary fabrication spaces.

Requirements

Ph.D. or M.S. in a field related to nanofabrication with at least 3 years of hands-on experience in micro/nanofabrication process engineering or process integration.
Exemplary candidates with a B.S. and extensive on-the-job experience and demonstrated breadth and depth of fabrication expertise will also be considered.
A demonstrated ability to develop and execute rigorous experimental plans
Tool operation expertise and theoretical understanding in at least one of lithography, etch, thin films, metrology, and inspection.

Nice To Haves

Tool operation expertise and theoretical understanding across multiple of lithography, etch, thin films, metrology, and inspection
Demonstrated skill in Scanning Electron Microscopy (SEM)
Expertise across full device fabrication flows
Experience with developing and executing standard process control
Demonstrated process integration and 3D integration experience
Prior experience in hybrid or heterogeneous multi-material integration (chemical mechanical polishing, surface preparation, chip-to-wafer or wafer-to-wafer bonding) of chiplets or wafers and novel material etch development and qualification is a plus.

Responsibilities

Initiating and executing short-loop and full-flow fabrication runs
Overseeing standard process runs to meet program needs and improve device performance, yield, and reliability
Supporting fabrication runs in the 200 mm Microelectronics Laboratory
Monitoring in-line process metrology
Performing a process integration role
Processing experiments
Completing independent tasks while working with a team of engineers and scientists across a range of skill and experience levels