Photolithography Process Development Engineer
About The Position
We are looking for a hardworking and passionate Photolithography Process Development Engineer for our Florida Advanced Packaging site. In this role you will lead, develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent analytical, oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management. Responsibilities: • Lead / Assist with processes development/ integration for new fan out wafer level packaging and Heterogeneous 3D Integration in a development-to-manufacturing environment.• Fundamental understanding of lithography metrology, resist chemistries, Dry Film Resists, process bias stackups and DOE characterization• Support CD-SEM /Overlay/ Inspection/Defect Review/Camtek etc. and be able to create recipes and run wafers independently.• Lead or work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications.• Investigate and drive integration changes for improved device performance and yield improvement.• Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by integration changes.• Establishment of Work Instructions, FMEAs, control plans and OCAPs The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position. Required Qualifications: Education: BS Engineering, Physics, Electrical Engineering, Materials Science or equivalent. Experience and Skills: • Experience with Maskless Lithography techniques a plus• 8-10 years' experience in Semiconductor or MEMS photolithography process development.• MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree.• Experience with contact mask aligners, steppers, Target generation, alignment trees and recovery schemes• Back-end-of-line (BEOL) or front-end-of-line (FEOL) fab processing tools knowledge/experience.• Familiarity or proficiency with FMEA, DOEs, 8Ds and other structured engineering approaches.• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.• Experience with customer interfacing to solve problems and transfer processes a plus.• Can work both independently and in (or lead) cross-functional teams for problem solving.• Desire to be part of a team that will transform the electronics industry in the United States US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
Requirements
- BS Engineering, Physics, Electrical Engineering, Materials Science or equivalent.
- 8-10 years' experience in Semiconductor or MEMS photolithography process development.
- MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree.
- Experience with contact mask aligners, steppers, Target generation, alignment trees and recovery schemes
- Back-end-of-line (BEOL) or front-end-of-line (FEOL) fab processing tools knowledge/experience.
- Familiarity or proficiency with FMEA, DOEs, 8Ds and other structured engineering approaches.
- Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
- Can work both independently and in (or lead) cross-functional teams for problem solving.
- Desire to be part of a team that will transform the electronics industry in the United States
- US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
Nice To Haves
- Experience with Maskless Lithography techniques a plus
- Experience with customer interfacing to solve problems and transfer processes a plus.
Responsibilities
- Lead / Assist with processes development/ integration for new fan out wafer level packaging and Heterogeneous 3D Integration in a development-to-manufacturing environment.
- Fundamental understanding of lithography metrology, resist chemistries, Dry Film Resists, process bias stackups and DOE characterization
- Support CD-SEM /Overlay/ Inspection/Defect Review/Camtek etc. and be able to create recipes and run wafers independently.
- Lead or work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications.
- Investigate and drive integration changes for improved device performance and yield improvement.
- Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by integration changes.
- Establishment of Work Instructions, FMEAs, control plans and OCAPs
- The job also requires performing other duties as assigned.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Industry
Computer and Electronic Product Manufacturing
Number of Employees
501-1,000 employees
