PCBA Manufacturing Engineer

Flex•Milpitas, CA

2d•$114,300 - $157,100•Onsite

About The Position

Flex is seeking a PCBA Manufacturing Engineer to support the development, industrialization, and optimization of advanced PCBA manufacturing processes at its Milpitas, California campus. The role supports next-generation AI, rack-scale computing, and data center applications and is part of a cross-functional team building and scaling complex printed circuit board assemblies. The engineer will apply hands-on expertise across the complete SMT manufacturing process, including pick-and-place, reflow soldering, wave soldering, process validation, and yield improvement. The role also requires knowledge of PCBA chemistry, mechanical interactions, manufacturing design considerations, and advanced packaging technologies, including large BGA components used in high-performance AI infrastructure. The position reports to the Director, Operations Engineering.

Requirements

Bachelor's degree in Manufacturing Engineering, Mechanical Engineering, Materials Engineering, Electrical Engineering, or a related technical discipline.
3–5 years of hands-on experience in PCBA manufacturing.
Strong knowledge of the complete SMT process, including solder paste printing, pick-and-place, reflow soldering, wave soldering, AOI, SPI, X-ray inspection, and process optimization for high-volume production.
Experience supporting complex PCBAs featuring large BGAs, high-density assemblies, and advanced packaging technologies.
Ability to troubleshoot manufacturing defects such as voiding, head-in-pillow, bridging, warpage, insufficient solder, and BGA-related failures.
Strong understanding of PCBA materials, solder chemistry, thermal management, mechanical interactions, and reliability considerations affecting assembly performance and manufacturing yield.
Working knowledge of DFM, DFA, IPC standards, PFMEA, control plans, and manufacturing validation methodologies.
Experience supporting NPI programs from development through successful production ramp.
Strong analytical, problem-solving, and cross-functional collaboration skills in a fast-paced manufacturing environment.

Nice To Haves

Experience supporting AI servers, accelerator cards, GPU-based platforms, rack-scale computing, or data center infrastructure products.

Responsibilities

Drive and optimize end-to-end PCBA manufacturing processes, including solder paste printing, pick-and-place, reflow, wave soldering, inspection, and final assembly.
Lead NPI builds and production readiness activities, partnering with Design, Quality, Test, Supply Chain, and Operations to ensure manufacturability, yield, reliability, and scalable production.
Provide technical expertise for complex PCBAs with large BGA devices, including process development, thermal profiling, defect reduction, DFM/DFA reviews, and assembly optimization.
Troubleshoot manufacturing, process, and product issues using structured root cause analysis and implement corrective and preventive actions to improve quality and throughput.
Develop and maintain manufacturing documentation, including work instructions, process specifications, PFMEAs, control plans, validation reports, and process control strategies.
Analyze manufacturing data and lead continuous improvement initiatives focused on yield enhancement, cycle-time reduction, cost optimization, equipment efficiency, and operational excellence.