PCB Layout Lead

Cerebras SystemsSunnyvale, CA
$210,000 - $230,000Hybrid

About The Position

Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. This architecture allows Cerebras to deliver industry-leading training and inference speeds; over 10 times faster than GPU-based hyperscale cloud inference services. This order of magnitude increase in speed is transforming the user experience of AI applications, unlocking real-time iteration and increasing intelligence via additional agentic computation. Cerebras works with the leading model labs, global enterprises, and cutting-edge AI-native startups. OpenAI recently announced a multi-year partnership with Cerebras, to deploy 750 megawatts of scale, transforming key workloads with ultra high-speed inference. Cerebras is seeking an exceptional PCB Layout Lead to own the physical implementation of complex, high-performance printed circuit boards for AI systems. This role will translate schematics and engineering requirements into production-ready layouts, optimizing signal integrity, power integrity, thermal performance, reliability, and manufacturability.

Requirements

  • Bachelor’s degree in electrical engineering, electronics engineering, or a related field, or equivalent practical experience.
  • 10+ years of hands-on experience laying out complex, high-speed, multilayer printed circuit boards.
  • Expertise with Cadence Allegro PCB Designer and Constraint Manager; experience with Altium Designer or equivalent tools is also relevant.
  • Strong knowledge of component placement, controlled-impedance routing, differential pairs, length matching, return-path continuity, and power distribution.
  • Experience with dense BGA escape routing, HDI structures, blind and buried vias, microvias, via-in-pad, and backdrilling.
  • Working knowledge of signal integrity, power integrity, EMI/EMC, thermal design, creepage and clearance, and high-current routing.
  • Experience applying IPC standards and fabrication, assembly, test, and manufacturability requirements.
  • Ability to create and review complete PCB fabrication and assembly release packages.
  • Ability to thrive in a fast-paced, dynamic environment and adapt to changing priorities.
  • Excellent collaborative and interpersonal skills with multi-disciplined teams.
  • Experience working on server hardware, AI accelerators, hardware accelerator, datacenter, AI Hardware, enterprise product.

Nice To Haves

  • Experience designing large, high-layer-count boards for compute, networking, server, or AI accelerator systems.
  • Experience routing high-speed interfaces such as DDR4/DDR5, PCIe Gen4/Gen5 or later, Ethernet, USB, and multi-gigabit SerDes.
  • Experience with high-current, low-voltage power delivery, VRM placement, decoupling strategy, copper balancing, and thermal optimization.
  • Experience developing Allegro SKILL, scripts, or automation that improves layout quality and release efficiency.
  • Demonstrated success delivering first-pass functional boards and supporting products from prototype through volume production.

Responsibilities

  • Own multilayer PCB layout from initial component placement through fabrication and assembly release.
  • Translate schematics, mechanical constraints, and electrical requirements into constraint-driven board designs using industry-standard PCB layout tools.
  • Define and implement board stackups, controlled-impedance structures, routing rules, reference planes, return paths, and length- and phase-matching constraints.
  • Place and route high-speed digital, high-current power, and sensitive analog circuits, including dense BGA fanout and differential interfaces.
  • Apply signal-integrity and power-integrity best practices to minimize crosstalk, discontinuities, noise, voltage drop, and electromagnetic interference.
  • Collaborate with electrical, SI/PI, mechanical, thermal, compliance, manufacturing, and test engineers to establish constraints and resolve layout issues.
  • Work with fabrication and assembly partners to select materials, validate stackups and via structures, and improve yield, cost, and schedule.
  • Perform design reviews and DFM, DFA, and DFT checks; generate and verify fabrication drawings, assembly drawings, drill data, Gerbers, ODB++, IPC-2581, and related release packages.
  • Maintain component footprints, padstacks, design libraries, layout standards, and release documentation.
  • Support prototype builds, board bring-up, failure analysis, and layout revisions through production.

Benefits

  • Actual compensation may include bonus and equity
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