PCB Layout Engineer (Taiwan)

Etched•San Jose, CA

22h•Onsite

About The Position

Etched is seeking a skilled PCB Layout Engineer to join their dynamic team and contribute to high-performance data center products. This role involves designing and optimizing printed circuit boards (PCBs) using Cadence Allegro PCB design tools, with a primary focus on high-speed signaling (including 100G applications), power distribution, large BGA ball-map breakouts, and complex HDI PCB stack-ups. The engineer's expertise will be crucial in ensuring products meet high standards of performance, reliability, and efficiency for data center environments.

Requirements

Have a Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a related field.
Are equipped with 10 years of experience in PCB layout design with a focus on high-speed signaling, power distribution, and HDI stack-ups, ideally for high-performance data center products.
Demonstrate proficiency in Cadence Allegro PCB design tools
Command in-depth knowledge of high-speed digital design principles, including signal integrity and impedance control.
Have Experience with complex HDI PCB design and manufacturing processes.
Understand power distribution network design and thermal management techniques, particularly for data center applications.
Are excellent at problem-solving skills and attention to detail.

Nice To Haves

Advanced degrees or certifications are a plus.

Responsibilities

Lead the design and optimization of high-speed PCB layouts using Cadence Allegro, tailored for 100G signaling. Implement strategies for impedance matching, trace routing, and crosstalk mitigation, resulting in robust designs that meet the stringent performance demands of modern data centers.
Develop and implement power distribution networks for cutting-edge data center hardware. Design power planes, decoupling strategies, and thermal management solutions to support high-performance systems, ensuring reliability and efficiency under heavy operational loads.
Manage the design of complex High-Density Interconnect (HDI) PCB stack-ups for multi-layer boards. Integrate blind/buried vias and microvias to meet the advanced technological requirements of data center systems, enhancing signal integrity and achieving compact form factors.
Collaborate with electrical and mechanical engineering teams to integrate PCB designs within the overall system architecture. Provide key input during design reviews to optimize performance, ensure manufacturability, and align with system-level objectives in a data center environment.