PCB Layout Engineer - Avionics

E-Space•Saratoga, CA

7d•$150,000 - $250,000•Onsite

About The Position

E-Space is bridging Earth and space to enable hyper-scaled deployments of Internet of Things (IoT) solutions and services. We are building a highly-advanced low Earth orbit (LEO) space system that will fundamentally change the design, economics, manufacturing and service delivery associated with traditional satellite and terrestrial IoT systems. Weâre intentional, weâre unapologetically curious and weâre 100% committed to innovate space-based communications and deliver actionable intelligence that will expand global economies, protect space and our planet and enhance our overall quality of life. We are hiring PCB Layout Engineers to design and deliver board layouts for a satellite constellation program involving 19 avionics boards across 6 subsystems. You will work closely with electrical design engineers, signal integrity analysts, and manufacturing teams to produce high-quality, flight-ready PCB layouts meeting stringent space-grade requirements.

Requirements

Bachelorâs degree in Electrical Engineering, Electronic Engineering, or equivalent experience.
5+ years of PCB layout experience for complex multi-layer boards (12+ layers).
Proficiency with Altium Designer (strongly preferred) or equivalent PCB CAD tools (Allegro, Zuken).
Demonstrated experience with impedance-controlled routing and high-speed signal layout.
Strong understanding of stack-up design for digital, power, and mixed-signal applications.
Experience creating fabrication packages (Gerbers, ODB++, drill files, assembly drawings).
Knowledge of IPC standards and design-for-manufacture best practices.

Nice To Haves

Experience with aerospace or space-grade PCB layouts and qualification requirements.
Background in RF/microwave PCB layout including matching networks and transmission-line structures.
Familiarity with signal integrity and power integrity simulation tools (HyperLynx, Sigrity).
Experience with Zuken CR-8000 or other enterprise PCB CAD tools.
Knowledge of high-speed signal attenuation, dispersion, and copper-loss mechanisms.
Experience with flex and rigid-flex PCB design.

Responsibilities

Develop PCB stack-ups for complex mixed-signal, power, and RF designs with appropriate impedance control.
Perform component placement optimized for signal integrity, thermal management, and manufacturability.
Route high-speed digital interfaces (SERDES, DDR, LVDS) with impedance-controlled transmission lines.
Implement power distribution plane design with attention to current density, loop area, and decoupling strategy.
Apply mixed-signal layout techniques with proper analog, digital, and RF isolation and partitioning.
Create and maintain footprint libraries and serve as Altium librarian for the program.
Manage design-rule and constraint creation including clearances, lengths, impedance targets, vias, and creepage/clearance requirements.
Produce layout documentation including fabrication drawings, assembly drawings, layer stack tables, and manufacturing notes.
Address RF parasitic effects through ground fencing, stitching vias, partitioning, and shielding techniques.
Coordinate with fabrication and assembly vendors for DFM reviews and manufacturing handoff.