Packaging SIPI Engineer, Principal Engineer

Qualcomm • San Diego, CA

66d • $201,600 - $302,400

About The Position

The candidate will work in a collaborative engineering environment, performing signal and power integrity tasks while partnering with package, platform and IC designers to optimize package and system designs. Primary responsibilities include electrical model extraction, signal and power integrity simulations, and clear reporting of results. This role requires effective collaboration with board, package, and IC design teams across organizational boundaries. The candidate will support high-speed SerDes electrical model extraction and system-level simulation for high-speed computing and server projects.

Requirements

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.

Nice To Haves

• 10+ years of experience with high-speed SerDes package, PCB, or system design for computing/server standards.
• Strong background in electromagnetics, transmission line theory, and crosstalk.
• Proficiency with field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity, as well as SPICE transient simulation tools such as ADS and HSPICE, including IBIS and IBIS-AMI models.
• Experience with SerDes specifications such as PCIe, USB, UFS, and MIPI.
• Experience using MATLAB to automate simulation workflows.
• Experience with programming languages such as C/C++ or scripting languages such as Perl/Python is a plus.
• Master’s or Ph.D. degree with 10+ years of industry experience.

Responsibilities

• Perform IO analysis using established methodologies, including model extraction, simulation, and reporting. IO types include various serial interfaces.
• Analyze IO power distribution for product development and reference systems using established methodologies.
• Perform package extraction for time- and frequency-domain analysis and provide package design guidelines.
• Document results clearly and thoroughly.

Benefits

• Competitive annual discretionary bonus program
• Opportunity for annual RSU grants
• Competitive benefits package designed to support your success at work, at home, and at play.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal