Packaging Research and Development Engineer

Intel Corporation • Chandler, AZ

1d • Onsite

About The Position

Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development Client/Server product substrate technology development and to scale EMIB substrate packaging technology to enable further die disaggregation / heterogenous integration. This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Requirements

• You must possess the below minimum qualifications to be initially considered for this position.
• Candidates should meet one of the following qualifications:
• Bachelor’s degree in Materials Science and Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, Mechanical Engineering, or a related field with 3+ years of semiconductor industry experience, or
• Master’s degree in Materials Science and Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, Mechanical Engineering, or a related field with 2+ years of semiconductor industry experience, or
• PhD degree in Materials Science and Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, Mechanical Engineering, or a related field
• Written and verbal communication and teamwork skills.
• Interact with equipment and materials suppliers.
• Willingness to travel (some travel may be required, less than 5 percent)
• Work with ambiguity and flexibility with respect to job roles and working hours is required.

Nice To Haves

• 1+ years of experience in the following:
• Engineering troubleshooting and analytical skills on integrated technology issues and experience working with broad team of other process and integration engineers.
• Experience owning process tools with strong knowledge of SPC PCS RFCs equipment troubleshooting statistical design of experiments and process development.
• Experience working with a variety of organic/inorganic materials and processes as well as characterizations utilizing techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM, etc. is highly desirable.
• Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning.

Responsibilities

• Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
• Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials interactions
• Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
• Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees