Packaging Research and Development Engineer

Intel • Chandler, AZ

1d • Onsite

About The Position

The Role and ImpactJoin Intel's Advanced Packaging Team and contribute to the Substrate Packaging Technology Development (SPTD) organization, where we strive to be the supplier of choice for leading and affordable substrate packaging. As a Packaging Module Development Engineer, you will play a pivotal role in developing innovative assembly processes and equipment that enable Intel's roadmap of future assembly packaging technologies.This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry. The ideal candidate should exhibit the following behavioral traits and/or skills:- Written and verbal communication and teamwork skills. - Interact with equipment and materials suppliers. - Willingness to travel (some travel may be required, less than 5 percent) - Work with ambiguity and flexibility with respect to job roles and working hours is required.

Requirements

• You must possess the below minimum qualifications to be initially considered for this position.
• Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
• Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .
• Master’s degree required or Bachelor’s degree with a minimum of one (1)+ year of relevant experience in one of the following disciplines: Materials Science and Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, Mechanical Engineering or any other related engineering fields

Nice To Haves

• 3+ months of experience in the following:
• Engineering troubleshooting and analytical skills on integrated technology issues and experience working with broad team of other process and integration engineers.
• Experience owning process tools with knowledge of SPC PCS RFCs equipment troubleshooting statistical design of experiments and process development.
• Experience working with a variety of organic/inorganic materials and processes as well as characterizations utilizing techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM, etc. is highly desirable.
• Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning.

Responsibilities

• Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
• Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials interactions
• Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
• Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees