Packaging Research and Development Engineer

Intel Corporation • Chandler, AZ

2d • Onsite

About The Position

Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration. This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Requirements

• Candidate must possess a PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related.
• Minimum 3 months of experience with statistical data analysis, Python or machine learning.

Nice To Haves

• 1+ years of experience in the following:
• Engineering troubleshooting and analytical skills on integrated technology issues and experience working with broad team of other process and integration engineers.
• Experience owning process tools with knowledge of SPC PCS RFCs equipment troubleshooting statistical design of experiments and process development.
• Experience working with a variety of organic/inorganic materials and processes as well as characterizations utilizing techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM, etc. is highly desirable.
• Experience JMP and JSL, relational database structure and usage, 1+ years of experience in a relevant science or engineering field.
• Written and verbal communication and teamwork skills.
• Interact with equipment and materials suppliers.
• Willingness to travel (some travel may be required, less than 5 percent)
• Work with ambiguity and flexibility with respect to job roles and working hours is required.

Responsibilities

• Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
• Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials interactions
• Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
• Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees